微量Ni對Al-4.5Cu-0.3Mg-0.15Ti合金熱穩定性之影響

NCUIR > Engineering College > Institute of Materials Science and Engineering > Electronic Thesis & Dissertation > Item 987654321/71616

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/71616

Title:	微量Ni對Al-4.5Cu-0.3Mg-0.15Ti合金熱穩定性之影響
Authors:	李宗龢;Li,Zong-He
Contributors:	材料科學與工程研究所
Keywords:	磨耗;熱穩定;機械性質;Al-Cu-Ng
Date:	2016-07-22
Issue Date:	2016-10-13 13:22:39 (UTC+8)
Publisher:	國立中央大學
Abstract:	本研究之目的是探討微量鎳與熱處理對Al-4.5Cu-0.3Mg-0.15Ti(wt%)合金機械、磨耗與熱穩定性質之影響，結果顯示鑄態下微量鎳之合金於凝固過程中晶出(Al，Cu，Ni，Fe)之介金屬化合物。人工時效後，二合金均會析出Al2CuMg、Al2Cu，進而提升導電度和硬度，而添加鎳之合金雖會消耗合金中之強化元素，導致硬度上升趨勢較緩慢，但卻能使其熱穩定性顯著提升。人工時效(150℃48hr)後，未含鎳之合金擁有最高之抗拉強度，經磨耗後，雖磨損表面顆粒剝落顯著，但其基地愈保持完整。而含鎳之合金則具有低抗拉強度與最佳伸長量，經磨耗後，表面剝落嚴重且基地受損較顯著，導致未添加鎳之合金有較優的磨耗性質。 ;The purpose of this research was to investigate the influence of trace nickel and Heat Treatment on Al-4.5Cu-0.3Mg-0.15Ti (wt%) alloy mechanical, abrasion and thermal stability properties, the results show as cast alloy solidification trace nickel in CRYSTALLIZATION the (Al, Cu, Ni, Fe) of the intermetallic compound. After artificial aging, the two-alloy will precipitate Al2CuMg, Al2Cu, and thus enhance the conductivity and hardness, while adding nickel alloy, although the alloy will consume the strengthening elements, resulting in hardness rise more slowly, but it can make significant thermal stability promotion. Artificial aging (150 ℃ 48hr) after excluding nickel alloy has the highest tensile strength, after wear, though the wear surface of the particles flaking significant, but its base of more intact. The alloy containing nickel has a low tensile strength and the elongation of the best, after abrasion, flaking and severely damaged than the base significantly, resulting in nickel alloys have not added more excellent wear properties.
Appears in Collections:	[Institute of Materials Science and Engineering] Electronic Thesis & Dissertation

Files in This Item:

File	Description	Size	Format
index.html		0Kb	HTML	650	View/Open

社群 sharing

Loading...