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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/72354


    Title: 印刷電路板蝕刻製程設計與可視化驗證實驗
    Authors: 巫坤星;Wu,Kun-Shin
    Contributors: 機械工程學系在職專班
    Keywords: 印刷電路板;蝕刻機;銅膜;均勻性;水坑效應;printed circuit board;etching;copper foil;uniformity;puddle effect
    Date: 2016-06-30
    Issue Date: 2016-10-13 14:49:25 (UTC+8)
    Publisher: 國立中央大學
    Abstract: 有鑒於印刷電路板產業的蝕刻製程中始終存在不同類型的蝕刻問題,其中最重要的莫過於銅膜(俗稱銅皮) 蝕刻後厚度分佈均勻性的問題。尤其目前業界均採取以輸送輪傳送的水平式噴灑蝕刻製程,均面臨銅膜中心位置的水坑效應及板面因接觸滾輪造成板面微細線路刮傷及汙染等問題,嚴重影響製品的整體品質。因此新型的蝕刻製程之開發,有助於改善此一問題。
    本論文研究之目標係建立之可視化實驗方法,探討新型蝕刻製程設計參數之關聯性,並以實際蝕刻加以驗證。本研究在定性條件下,先就單噴嘴之噴灑高低速及順、逆轉條件下之結果,進而探討單噴嘴在不同偏心位置之順逆轉下之可視化實驗分析結果及實際蝕刻驗證,最後再以複數噴嘴條件分析與檢討相關參數,最終以實驗所得到之結論建立複數噴嘴製程最佳化設計。經實際蝕刻驗證,最佳化製程之均勻性可達92.1%,可有效改善目前製程品質。同時本研究所建立之可視化實驗方法,也可縮短相關設備的開發設計時間,並降低開發成本,增加市場競爭力。
    ;Several problems are found in the etching process for printed circuit board industry which affect also the design of etching machines. The most important of them is the distribution quality of the etched thickness of the copper foil. In particular, the current transport method in the horizontal etching process is to use conveyor rollers for PCB manufacturing. The problems, such as the puddle effect, the scratches and pollution of PCB`s due to the surface contact with rollers, will seriously affect the overall quality of the follow-up products. It is therefore necessary to develop a new type of etching machine to overcome this problem.
    The aim of this thesis is to propose a visualized method for the new etching process to study experimentally the correlation between the recorded imageds and design parameters. Additionally the design parameters are also validated by the accual etching process. In the qualitative conditions, the results from the experiment with a single nozzle spraying in high/low speed and forward/reverse conditions are at first studied. And then the experimental results in the case of the single nozzle in different eccentric positions along the forward/reverse are also used to verify the analysis of actual etching results. At last, the conditions of multiple nozzles and the related parameters are analyzed and discussed.
    Finally, according to the conclusions obtained by the study with multiple nozzles, a optimized arrangement design. The uniformity of the optimized process can be up to 92.1%, which can effectively improve the quality of the current process. At the same time, the visualized experimental method established by this research cannot only shorten the design time and reduce the development cost, but also increase the competitiveness for marketing.
    Appears in Collections:[機械工程學系碩士在職專班 ] 博碩士論文

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