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    Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/72388


    Title: 移動刀具之遮罩式微電化學加工模擬與分析;Modeling and Analysis of Through-mask Electrochemical Micro-machining with a Moving Tool
    Authors: 陳千蕙;Chen,Chien-Hui
    Contributors: 機械工程學系
    Keywords: 遮罩式微電化學加工;有限元素法;移動刀具;模擬;through-mask electrochemical micro-machining (TMEMM);finite element method;moving tool;simulation
    Date: 2016-07-12
    Issue Date: 2016-10-13 14:51:43 (UTC+8)
    Publisher: 國立中央大學
    Abstract: 目前遮罩式微電化學加工的發展都僅於靜態加工,刀具的大小通常須與工件之加工區大小相同,然而,在電化學加工中,需選擇一導電性良好之金屬作為刀具電極,這樣的金屬通常要價不斐。基於成本考量,本文試著縮小刀具尺寸,給定刀具一移動速度,利用有限元素法創建移動刀具之遮罩式微電化學加工的電場模型,探討動態加工時的施加電壓、遮罩厚度、刀具移動速度等參數對加工形狀的影響。
      由模擬結果顯示,在電壓越大時,加工深度越深,加工孔徑越大,且深寬比越佳;在遮罩厚度較薄時,電場分佈不均,側向腐蝕較為嚴重,工件中心會有島狀現象產生,這和遮罩的遮蔽性有關;在移動速度較慢時,相對加工時間較長,工件表面累積之電流密度越多,材料移除率越大;而隨著加工時間的增加,側向腐蝕速率會趨緩,使得深寬比漸佳。
    ;The development of through-mask electrochemical micro-machining is restricted in the static processing. The size of the tool needs to be the same as the processing zone. However, the electrode of the tool is required to be a good conductivity metal, which is expensive. Based on the cost, in this study, we try to reduce the size of the tool along with a moving speed. The electric field of through-mask electrochemical micro-machining with a moving tool is simulated by using finite element method. Effects of parameters, such as: applied voltage, mask thickness and moving speed etc…, on the resulted holes are investigated.
      The simulation show that, as the voltage is increased, the machining depth is deeper, the hole diameter is bigger and the aspect ratio is higher. When the thickness of the mask is thinner, the electric field distribution is un-uniform and the lateral etching is higher. The island phenomenon will occur at the center of the workpiece. This is due to the shadow effect of the mask. When the moving speed is slow, the longer processing time causes more current density accumulated on the surface of the workpiece, such that the material removal rate is higher. As the processing time is increased, the lateral etching rate will become slow and the aspect ratio thus become better.
    Appears in Collections:[機械工程研究所] 博碩士論文

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