於工業製程中對銅材進行滾壓機械加工，其加工表面會生成一表面滾壓層(surface rolling layer)，已於先前之研究被定義出。此表面滾壓層之特性以及其厚度將影響銅材與焊料之間之濕潤性質，先前研究指出具有較厚之表面滾壓層會導致濕潤性之下降，進而降低焊接可靠度。因此，將針對此表面滾壓層做更深入之探討並藉由氧化還原處理以改善銅材之表面可焊性。於第四章中，我們先針對影響銅材與焊料的溼潤性質之可行性進行探討，首先，藉由可焊性測試(Soldering test)與低掠角X光繞射儀(Grazing Incident X-ray Diffraction)，我們發現相對表面殘留應力(relative residual stress)與可焊性兩者之間存在對應的關係，而表面殘留應力則來自於表面破壞產生的固有缺陷(intrinsic defect)。同時，藉由光電子能譜儀(X-ray Photoelectron Spectroscopy)以及紫外光電子能譜儀(Ultraviolet Photoelectron Spectroscopy)對氧化銅表面進行分析，探討固有缺陷對於光電子特性之影響，兩論點可以被建立出：(1)不同殘留應力對庫倫作用能之影響和(2)固有缺陷造成之自由電子濃度差異對功函數之影響。最後在第五章，再利用這些論點去建立氧化還原處理以改善銅材之表面可焊性之機制。;Cu always processed into mechanical cold work in technological industry. The surface rolling layer (SRL) would form on the Cu which is defined in previous research. The characteristics and thickness of SRL would affect the wetting performance between rolled-Cu and high-Pb solder. Previous research indicated that the thicker SRL would cause wetting performance decreasing, hence decreasing the reliability of solder joint. Therefore, in this work, we will discuss the physical properties of SRL in a detail and solderability improving by redox treatment. In Chapter 4, we further discuss about the factors affecting the solderability. First, we compare to GIXRD and solderability of Cu lead-frames, the relative residual stress of Cu was corresponded to solderability and indicated that the well solderability shows the relative low strained on Cu surface. The main factor for the residual stress is more likely to be intrinsic defects formed in the manufactured process.Then, we use XPS/UPS analysis of the CuxO surface to observe the photo-electronic properties affecting by the intrinsic defects. With knowing all the probably factors affecting the photo-electronic behaviors in the intrinsic defects, we can construct two versions for the intrinsic defects affecting photo-electronic behaviors. First one is the difference of Coulomb interaction energy observing in Cu 2p spectrum. The second one is the work function with various free electron concentration trapped by the defects. Afterwards, we combine these two versions into the mechanism. The mechanism of improving solderability by redox treatment was established.