評估傳統濕式洗滌塔對印刷電路板防焊製程之揮發性有機氣體去除效率之研究;Evaluation on the Removal Efficiency of Volatile Organic Compounds (VOCs) produced from PCB Solder Mask Process by Wet Scrubber

NCUIR > Engineering College > Executive Master of Environmental Engineering > Electronic Thesis & Dissertation > Item 987654321/78038

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/78038

Title:	評估傳統濕式洗滌塔對印刷電路板防焊製程之揮發性有機氣體去除效率之研究;Evaluation on the Removal Efficiency of Volatile Organic Compounds (VOCs) produced from PCB Solder Mask Process by Wet Scrubber
Authors:	徐鵬展;Hsu, Peng-Chan
Contributors:	環境工程研究所在職專班
Keywords:	濕式洗滌塔;揮發性有機氣體;液氣比;印刷電路板;防焊製程;wet scrubber;VOCs;liquid-gas ratio;printed circuit board;solder mask
Date:	2018-08-22
Issue Date:	2018-08-31 15:09:37 (UTC+8)
Publisher:	國立中央大學
Abstract:	本研究主要在於探討印刷電路板防焊製程中，使用傳統濕式洗滌塔對製程產生的 VOCs 去除效率，與建立廠內的洗滌塔操作條件，研究同時分析在不同操作條件下建立 VOCs 之排放係數。實驗分析結果顯示，在液氣比方面，固定 pH 在 8~9，液氣比分別為 1.25、 1.45、1.66 三種液氣比，液氣比於 1.25 時，VOCs 的平均去除濃度 8.66ppm，去除效率介於 34%~43%。液氣比 1.45 時，平均去除濃度為 11.39ppm，去除效率介於 47%~56%。液氣比 1.66 時，平均去除濃度為 16ppm，去除效率介於 36%~73%。提高液氣比，確實對去除效率有幫助，每增加 50L/min 的灑水量，VOCs 平均去除效率約上升 9%~13%，VOCs 平均去除濃度，則增加 2.73ppm~4.61ppm。就排放係數而言，在液氣比 1.66，經過洗滌塔後，pH6~7 排放係數 0.0019kg/m ，pH7~8 排放係數 0.0024 kg/m2，pH8~9 排放係數 0.0016 kg/m2，試驗所得之 VOCs 排放係數，均低於環保署所公告之印刷電路板排放係數(0.026 kg/m2)，同時在 pH8~9 操作範圍，時可得最低之排放係數。綜合比較實驗分析結果，本廠印刷電路板防焊製程較佳的操作條件，主要包括酸鹼值控制在 pH8~9 及液氣比控制在 1.66，同時洗滌液循環水補充量為 5.12 L/min，且循環水每 2.7 小時(162min)須更換一次，整體而言，本研究之初步成果，除可提供洗滌塔操作條件設定參考外，並可作為未來操作人員執行相關工作之依據。;This study aims to investigate the removal efficiency of volatile organic compounds (VOCs) produced from the printed circuit board (PCB) solder mask process using the traditional wet scrubber. The optimum operation conditions of scrubber and emission factor of VOCs in the full scale PCB solder mask manufacturing plant were also discussed. The experimental results indicated that the average removal concentration of VOCs was 8.66 ppm operated at liquid-to-gas (L/S) ratio 1.25 and pH ranged from 8.0 to 9.0. Meanwhile, the removal efficiency of VOCs was approximately from 34% to 43%. The average VOC removal concentration was increased from 11.39 ppm to 16.0 ppm with an increase in L/S ratio from 1.45 to 1.66. It could conclude that the increasing in L/S ratio could enhance removal efficiency of VOCs during PCB solder mask process. The average increment in VOCs removal efficiency was 9% to 13% with an increment of 50 L/min in water spray amounts. In the case of L/S ratio of 1.66, emission factors of VOCs conducted in this research were 0.0019 kg/m2(pH ranged from 6.0 to 7.0), 0.0024 kg/m2 (pH ranged from 7.0 to 8.0), and 0.0016 kg/m2 (pH ranged from 8.0 to 9.0), respectively. The lowest emission factor of VOCs occurred at pH range between 8.0 and 9.0. All emission factors of VOCs were done in this research could comply with the VOCs emission requirement (0.026 kg/m2) of the Environmental Protection Administration (EPA).. Based on the experimental results of this research, the optimum operation conditions for tested PCB solder mask manufacturing process were including the range of pH 8.0 to 9.0, L/S ratio of 1.66, and washing water circulation of 5.12 L/min. It implied that the washing water for applying wet scrubber should be changed to fresh washing water when the scrubber operated continuously 2.7 hours (162 mins). In summary, the preliminary results obtained from this study could provide the good information for operation conditions of wet scrubber, but also could provide the good operation experiences for relevant operators in the future work.
Appears in Collections:	[Executive Master of Environmental Engineering] Electronic Thesis & Dissertation

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