覆晶載板主要是作為晶片與印刷電路板之間的電子訊號傳遞橋梁，而圓弧定位孔的用途是將覆晶載板能依照正確的方向固定至印刷電路板的正確位置上，由於此圓弧定位孔位於載板的邊緣位置，即使在封裝完IC晶片後仍然被消費者直接目視可見，因此外觀的規格要求相對嚴格；由於覆晶載板的複雜度越來越高，體積也持續有增加的趨勢，本論文所研究的對象-U公司所面臨到的是近期客戶的產品之中，為了能夠穩固的將載板固定在正確的位置上，圓弧定位孔的數量在設計上一直增加，這也使得圓弧定位孔外觀不良的比例不斷的攀升，如何有效的降低此異常的比例儼然成為了重要的課題之一。 本篇論文以田口式實驗法，選取了包含鑽孔的參數、刀具的設計及外在的環境當作因子(Factor)，在不同的水準(Level)下所收集到的外觀不良率，進行訊號雜音比(S/N ratio)分析並取得各因子的最佳水準，再利用每個因子的最佳水準經過亞米加轉換(Omega transformation)之後進行預測，並將最佳水準參數配置進行確認實驗，最終達到降低外觀不良率的目的。 ;The IC carrier is mainly used as an electronic signal transmission bridge between the chip and the printed circuit board, and the purpose of the Notch hole is to fix the IC carrier in the correct direction to the correct position of the printed circuit board. The Notch hole is located at the edge of the carrier board, even if it is produce after the IC chip packaged process ,it can still directly visible to the consumer so that the specification of the appearance is relatively strict at this location. The complexity of the IC carrier is getting higher and the volume continues bigger, the number of notch hole designed are increased in the recent customer′s products in this paper-U company faced with. This increase makes the defect of the appearance of the Notch hole continue to rise. How to effectively reduce the defect proportion of the appearance on notch hole has become one of the important topics. In this paper, we use Taguchi method to reduce the appearance of Notch holes. We choose drill recipe items ,drill bit design and environment as the factor. The S/N ratio is analyzed and the optimal level of each factor is obtained. Then the optimal level of each factor is used to predict after Omega transformation, and the optimal level parameter is configured for confirmation. Finally, the purpose of reducing the appearance defect rate is achieved.