隨著鈣鈦礦太陽能電池蓬勃發展，眾多海內外學者陸續投入研究製程以及材料上的改善，以提高最終的光電轉換效率，在實驗室中最常使用的製程方法為刮刀塗佈法以及旋轉塗佈法，其中刮刀塗佈法有大面積製程、快速製程以及使用較少的前驅溶液等優點。 使用溶液製程處理電洞傳輸層的過程中，若電洞傳輸材料的溶解度不好，會導致製程時成膜性不佳，無法忠實呈現材料的特性。本實驗選用兩種電洞傳輸材料，分別是溶解度好的YKP03以及溶解度差的ZYW01，探討不同製程方式與材料溶解度對成膜之後表面形態的影響；由於旋轉塗佈法無法控制基板溫度，使其只能於室溫下操作，而刮刀塗佈法則可以控制基板溫度，可依照不同的條件選擇刮刀塗佈的溫度，以溶解度好的材料YKP03來說，摻雜(doping)條件於60°C，未摻雜(doping free)條件於125°C下進行刮刀塗佈法，能獲得最佳的光伏表現；以溶解度差的電洞傳輸材料ZYW01來說，由於旋轉塗佈法無法控制基板溫度，即使溶液加熱到溶解所需的溫度，在旋轉塗佈的過程中也會因溫度下降而析出，導致成膜性不佳，元件光電轉換效率為1.22%，此時使用刮刀塗佈法，則可有效的改善此一現象，控制基板溫度使得電洞傳輸材料溶液在塗佈的過程中維持其溶解所需要的溫度，進而改善電洞傳輸層之形態，在125°C下進行刮刀塗佈法所製備之元件光電轉換效率為10.84%。 ;With the development of the perovskite solar cells (PSCs), many scholars have successively invested in research processes and material improvements to improve the photoelectric conversion efficiency(PCE). The most commonly used coating methods in the laboratory are blade coating and spin coating. The blade coating has advantages such as relatively fast and facile processing steps and much less precursor solution is wasted compared to spin coating If the solubility of the hole-transporting material (HTM) is not good, it will cause the hole-transporting layer (HTL) has poor film forming properties during the solution coating process. It may lead HTMs display the property which is not reality. We choose two HTMs for the experiment. There are YKP03 and ZYW01, which solubility is good and poor. Study the influence of different coating methods and HTM solubility on the surface morphology. Spin coating method can only be operated at room temperature, because it cannot control the substrate temperature. However the blade coating method can control the temperature of substrate. According to different conditions, we can select the proper temperature for the experiment. For YKP03, a HTM with good solubility, blade coating at 60°C and 125°C for doping and doping free condition have the best film morphology. For ZYW01, a HTM with poor solubility, even if the solution is heated to the temperature required for dissolution, it will precipitate due to the temperature drop during the spin coating process. This results in poor film formation, and PCE of the device is 1.22%. At this time, blade coating method can improve this situation. The substrate is maintained at the temperature required for HTM dissolution. Improve the morphology of HTL. The PCE of device is 10.84%.
