應用影像處理於晶圓水痕及外觀瑕疵檢測之研究

NCUIR > Engineering College > Executive Master of Mechanical Engineering > Electronic Thesis & Dissertation > Item 987654321/85156

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/85156

Title:	應用影像處理於晶圓水痕及外觀瑕疵檢測之研究
Authors:	彭俞斐;Peng, Yu-Fei
Contributors:	機械工程學系在職專班
Keywords:	晶片檢測;編碼理論;MATLAB;霍夫轉換;水痕;Wafer Inspection;Coding Theory;MATLAB;Hough Transform;Water Mark
Date:	2020-12-29
Issue Date:	2021-03-18 18:22:09 (UTC+8)
Publisher:	國立中央大學
Abstract:	半導體製程對於品質控管要求格外嚴謹，良好的晶圓品質和產出，為晶圓製造重點，因此在晶片測試前晶圓檢驗是非常重要的環節，確保品質。目前半導體晶圓外觀檢測主要使用自動光學檢測(Automted Optical Inspection，AOI)，但AOI無法檢測出水痕缺陷，品質管制上有漏檢風險。本論文擬針對晶圓外觀檢驗缺陷，包含：(1)水痕、(2)錫球脫落、(3)錫球壓傷(4)晶面刮傷，利用機器視覺技術、編碼學、形態學、邊緣檢測，提出一個自動化的檢測演算，改善水痕漏檢問題。本論文之研究目的在於設計以自動視覺檢測系統為基礎的晶圓外觀缺陷檢測軟體，能檢測出晶粒表面中具有水痕的缺陷，以提升檢測效率。在實驗的部份，使用了100張晶面影像來驗證水痕缺陷檢驗的成效，水痕檢驗實驗的結果顯示檢測準確率為100％，精確率為100%。關鍵字:晶片檢測、編碼理論、MATLAB、霍夫轉換、水痕; Wafer product Quality is an important factor in semiconductor manufacturing. Die defect inspection is an important quality control process before chip probing. Conventionally,the inspection of die surface defects by AOI,but AOI can′t catch water mark. Unexpected minor defects that are hard to inspect make quality control more difficult. This research is to design and develop an automated visual inspection system for die surface defects by using the machine vision technology,coding theory, morphology,edge detection. The mainly focusedinspection items of dice are wafer mark,bump missing,bump damage and wafer scratch. A prototype of the visual inspection system for water mark defect inspection will be implemented for inspection efficiency. We use 100 images to test the performance of this system. The results of water mark inspection experiment show that the accuracy is 100%,precision is 100%. Keyword: Wafer Inspection、Coding Theory、MATLAB、Hough Transform、Water Mark
Appears in Collections:	[Executive Master of Mechanical Engineering] Electronic Thesis & Dissertation

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