關鍵詞：銲線壓力、研磨震幅、研磨頻率 、拉力值 、Stitch Bond撕裂。;In this paper, the studying of 0.7mil, 0.75mil, 0.8mil, 0.85mil, 0.9mil, 1.0mil diameter copper wire bonding second bond (stitch bond) process parameters optimization and unification through calculates by the bonding capillary dimension and wire diameter which can avoid the confusion of parameter application and the different performances caused by different engineer setting up the wire bonding parameters. The key parameters of wire bonding stitch bond process obtained through calculation are Bonding Force, Scrub Amplitude, and Scrub Frequency and applied these key parameters to the fixed model (K&S IConn Plus) and QFN packaged products then compared to the original product parameters. Through the actual application of the calculated parameters and the parameters of the current production line to the product then collect the stitch bond key index Wire Pull and Stitch Bond Peeling phenomenon by tensile testing machine and high-power microscope. Input the wire pull data into the JMP analysis software, and the analysis data can be obtained. After comparison the wire pull and stitch peeling performance, the parameters obtained by the calculation is comparable with original parameters and even better in some wire diameters therefore achieve the purpose of parameter unification.
