應用銲針尺寸與線徑之推算進行銲線製程第二銲點參數優化與統一之研究;The wire bonding process second bond parameters optimization and unification through capillary dimension and wire diameter calculation

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題名:	應用銲針尺寸與線徑之推算進行銲線製程第二銲點參數優化與統一之研究;The wire bonding process second bond parameters optimization and unification through capillary dimension and wire diameter calculation
作者:	潘俊維;Pan, Nick
貢獻者:	機械工程學系在職專班
關鍵詞:	銲線壓力;研磨震幅;研磨頻率;拉力值;Stitch Bond撕裂;Bonding Force;Scrub Amplitude;Scrub Frequency;Wire Pull;Stitch Bond Peeling
日期:	2022-07-05
上傳時間:	2022-10-04 12:10:49 (UTC+8)
出版者:	國立中央大學
摘要:	本文主要研究經由銅線線徑與銲針尺寸來計算得到封裝銲線製程中使用0.7mil、0.75mil、0.8mil、0.85mil、0.9mil、1.0mil等不同線徑的鍍鈀銅線時所使用的第二銲點製程參數並實際套用於產品驗證後來統一生產線上的封裝銲線製程第二銲點參數的建立方向，進而避免因不同人員建立銲線程式參數時產生的參數套用雜亂與效能不一等現象。透過計算後得到的等二銲點製程關鍵參數銲線壓力(Bonding Force)、研磨震幅(Scrub Amplitude)、研磨頻率(Scrub Frequency)，實際應用於固定的機型(K&S IConn Plus)與QFN封裝形式產品並與現行生產線上在製之第二銲點製程參數成品做比較。透過實際將計算之參數與現行生產線之參數應用於產品後經由拉力測試機與高倍顯微鏡觀察可得到第二銲點關鍵指標拉力值(Wire Pull)與Stitch Bond撕裂(Peeling)現象，經由統計後將資料輸入至JMP分析軟體，可以得到分析數據，比較後可得到在拉力值與Stitch Peeling方面的效能表現，採用計算所得之參數與現行生產使用之參數並無落差，在部分線徑上計算所得之參數的表現甚至更佳，進而達成參數統一的目的。關鍵詞：銲線壓力、研磨震幅、研磨頻率、拉力值、Stitch Bond撕裂。;In this paper, the studying of 0.7mil, 0.75mil, 0.8mil, 0.85mil, 0.9mil, 1.0mil diameter copper wire bonding second bond (stitch bond) process parameters optimization and unification through calculates by the bonding capillary dimension and wire diameter which can avoid the confusion of parameter application and the different performances caused by different engineer setting up the wire bonding parameters. The key parameters of wire bonding stitch bond process obtained through calculation are Bonding Force, Scrub Amplitude, and Scrub Frequency and applied these key parameters to the fixed model (K&S IConn Plus) and QFN packaged products then compared to the original product parameters. Through the actual application of the calculated parameters and the parameters of the current production line to the product then collect the stitch bond key index Wire Pull and Stitch Bond Peeling phenomenon by tensile testing machine and high-power microscope. Input the wire pull data into the JMP analysis software, and the analysis data can be obtained. After comparison the wire pull and stitch peeling performance, the parameters obtained by the calculation is comparable with original parameters and even better in some wire diameters therefore achieve the purpose of parameter unification. Keywords：Bonding Force, Scrub Amplitude, Scrub Frequency, Wire Pull, Stitch Bond Peeling.
顯示於類別:	[機械工程學系碩士在職專班 ] 博碩士論文

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