摘要 本論文以微波輔助純水與有機溶劑，進行熱塑型微流道之封裝製程，在微波輔助純水的接合製程中，除了有高接合強度以及接合覆蓋率以外，對於生物晶片中的微流道完整性以及微流道汙染等，可能影響到檢測結果的難題以及疑慮，透過微波輔助純水接合製程皆能有效的解決。而在微波輔助有機溶劑接合製程中，能使原先在低濃度有機溶劑無法進行接合的情形，在經過微波輔助下達成接合，並且與微波輔助純水接合製程相比更能大幅提升接合強度，因此不論是以微波輔助純水或者是有機溶劑進行接合製程，針對不同的接合製程下優化其接合參數。在接合製程中，首先需對於聚甲基丙烯酸甲酯(PMMA)基材表面進行改質的製程，包含兩種不同的改質方式，分別為物理性表面改質與有機溶劑表面改質，在經過表面改質製程後，便能使接合材料均勻的連結兩個接合面，並以簡單的加壓夾具對基材進行加壓後，透過微波加熱並接合，其中利用純水與有機溶劑的介電性，能夠在微波過程中針對接合介面加熱，達到介電加熱(Dielectric heating)的效果，而能夠有效改善微流道變形以及提升接合性能。因此在本論文中，除了探討純水經物理性表面改質，以及有機溶劑表面改質對於接合的影響之外，在經過微波的輔助下也大幅提升了接合性能，也對於相關微波的參數之影響進行探討。最後，從實驗結果中顯示，在以微波輔助純水以及有機溶劑接合中，最大的接合覆蓋率皆可以達到99%，而接合強度分別可以達到0.7MPa與2.6MPa，並且沒有微流道變形的情形產生。 ;Abstract This study demonstrated the microwave-assisted water/organic solvent bonding process for the thermoplastic microfluidics channel. This bonding process can effectively improve bonding coverage and strength. At the same time, it has the advantages of a clean and pollution-free bonding process, and microchannel integrity and can be a better bonding process for the microfluidic system for biological application. The previous bonding technologies of the biochip usually bonded the substrates via high concentration organic solvents or adhesive materials, which caused the samples of bioassays in the microchannel to be contaminated and reduced the accuracy of the detection results. In this bonding process, the polymethyl methacrylate (PMMA) substrates should be performed surface activation pretreatment followed by physical surface activation and organic solvent activation to achieve bonding. After activation, the water and organ solvents can spread more uniformly on the bonding interface. In the microwave heating process, water/organic solvent both have an excellent dielectric constant for dielectric heating the bonding interface. Moreover, this study will discuss the bonding mechanism of the surface activation for bonding the PMMA substrates and bonding performance on different bonding parameters. The result of experiments showed that the microwave-assisted water/organic solvent bonding method presents the maximum bonding coverage up to 99%, and bonding strength respectably up to 0.7MPa, and 2.6MPa, and without any microchannel distortion issue.
