硫脲及其衍生物添加對微陽極導引電鍍法製備銅微柱之結構及特性影響研究;Influence of thiourea and its derivatives addition on the Structure and Properties of copper micropillars prepared by microanode guided electroplating

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题名:	硫脲及其衍生物添加對微陽極導引電鍍法製備銅微柱之結構及特性影響研究;Influence of thiourea and its derivatives addition on the Structure and Properties of copper micropillars prepared by microanode guided electroplating
作者:	賴威全;LAI, WEI-QUAN
贡献者:	機械工程學系
关键词:	微電鍍;銅微柱;添加劑;硫脲;腐蝕;微螺旋;Micro-anode guided electroplating;Copper micro-pillars;Additive;thiourea;Corrosion;Micro-helix
日期:	2022-09-28
上传时间:	2022-10-04 12:17:41 (UTC+8)
出版者:	國立中央大學
摘要:	本研究以即時影像導引微電鍍法來製作銅微柱。使用線徑250 μm之白金線作為陽極，以線徑為0.643 mm之銅導線作為陰極，陰陽兩極間距為80 μm，在含硫酸銅、硫酸、硫脲以及硫脲衍生物鍍液中進行電鍍，希望製作出高強度及高導電率之銅微柱與微螺旋。研究目標，探討添加不同濃度硫脲以及硫脲衍生物對微柱析鍍物表面形貌、化學組成、晶體結構、機械性質以及抗蝕性能之影響，利用SEM、TEM、XRD來進行表面形貌之觀測及晶粒分析;利用微小維克氏和奈米壓痕試驗量測銅微柱之物理性質;使用四線式測量法測量不同參數之銅微柱的電導率 ;耐蝕性則是將微柱浸泡在3.5 wt.% NaCl(pH=8)的水溶液中，利用恆電位儀進行電化學試驗比較其腐蝕行為。結果顯示當鍍液使用烯丙基硫脲時，可以得到最大維克氏硬度265 HV，最大奈米壓痕硬度2.93 GPa，楊氏模數為87.53 GPa，電導率可以到達5.09 × 107 S．m-1，約等於商用銅線的85.52%的效能。在腐蝕試驗中腐蝕電位為-0.22 V (vs. SHE) ，腐蝕電流0.004 mA/ cm2，陽極斜率為59 mV dec-1。歸納製作微柱之最佳電鍍條件，隨後以此條件出發，探討製作微型螺旋之可行性，並研究微螺旋析鍍角度與製程參數對微型螺旋尺寸與線徑均勻度之影響。 ;In this study, a real-time image-guided micro-plating method was used to fabricate copper micropillars. A platinμm wire with a wire diameter of 250 μm was used as the anode, a copper wire with a wire diameter of 0.643 mm was used as the cathode, and the distance between the cathode and anode was 80 μm. It is hoped to produce copper micropillars and microspirals with high strength and high conductivity. The research goal is to explore the effect of adding different concentrations of thiourea and thiourea derivatives on the surface morphology, chemical composition, crystal structure, mechanical properties and corrosion resistance of micro-column deposition. SEM, TEM and XRD were used to analyze the surface morphology. Observation and grain analysis; using micro Vickers and nanoindentation test to measure the physical properties of copper micropillars; using four-wire measurement method to measure the electrical conductivity of copper micropillars with different parameters; The column was immersed in an aqueous solution of 3.5 wt.% NaCl with a pH of 8, and electrochemical tests were performed to compare its corrosion behavior using a potentiostat. The results show that the maximμm Vickers hardness of 265 HV, the maximμm nanoindentation hardness of 2.93 GPa, the positive modulus of 87.53 GPa and the electrical conductivity reaches 5.09 × 107 S. m-1, about 85.52% efficiency of copper can be obtained when allyl thiourea is used in the plating solution.. The corrosion potential is -0.22 V (vs. SHE), the corrosion current is 0.004 mA/cm2, and the anode slope is 59 mV dec-1. The optimμm electroplating conditions for making micro-pillars are sμmmarized, and then the feasibility of making micro-helix, is discussed based on these conditions, and the influence of micro-helix, precipitation angle and process parameters on micro-helix, size and wire diameter uniformity is studied.
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