高導電 高硬度 鋁 銀 銅 金屬薄膜 之 研 製;The Development of the High-Conductivity High-Hardness AlAgCu Thin Film

NCUIR > Engineering College > Graduate Institute of Mechanical Engineering > Electronic Thesis & Dissertation > Item 987654321/95884

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/95884

Title:	高導電高硬度鋁銀銅金屬薄膜之研製;The Development of the High-Conductivity High-Hardness AlAgCu Thin Film
Authors:	劉承德;Liu, Cheng-De
Contributors:	機械工程學系
Keywords:	非晶質合金;薄膜;機械性質;連接器;耐候;amorphous alloy;film;mechanical properties;connector;weather resistance
Date:	2024-07-24
Issue Date:	2024-10-09 17:21:48 (UTC+8)
Publisher:	國立中央大學
Abstract:	隨著3C商品與工業4.0的進步，帶動連接器產業的發展，越來越多研究開始導向以較低的價格提升連接器的效能，傳統連接端子為了增加與外層結合性，先鍍一層純鎳作為基底後，再鍍一層純金膜，這樣一來，由於鎳與金的價格昂貴，整體的成本也會不斷上升，因此使國內外連接器廠轉而開發及研究不同的鍍膜材料，以取代金與鎳。連接端子經常用於機器之間的連接，操作時端子與端子間須具備耐衝擊、耐插拔、低電阻、耐高溫、耐濕、耐腐蝕等特性，對於機械性質、電器性質及環境性質的要求極為重要，因此如何提升端子材料性質為研發上探討的核心項目之一。非晶質結構相比於一般結晶結構，提供了材料較高的硬度與耐磨耗性能，且因不具有晶界之特點，表現出極強的抗氧化及耐腐蝕特性，若應用於薄膜上將能有效應用作為端子材料。本研究開發鋁-銀-銅(Al -Ag -Cu)基金屬薄膜，嘗試取代昂貴的純金和純鎳薄膜，並利用直流磁控濺鍍法將合金以非晶質結構之形式鍍覆於玻璃基板上，來研究其機械性質及導電度。實驗結果顯示以直流磁控濺鍍法可以成功將鋁-銀-銅(Al-Ag-Cu)基以非晶質合金結構形式鍍覆於玻璃基板上，鍍膜後之鋁-銀-銅(Al-Ag-Cu)基非晶質合金結構能維持非晶態，薄膜的電阻率量測結果顯示，在經過快速退火熱處理後，Al46Ag35Cu19非晶態薄膜的電阻率將降低至低至98 μΩ∙cm，而Al70Ag15Cu15複合結構則降於39 μΩ∙cm。與純銅的42 μΩ∙cm及純鎳的141 μΩ∙cm相比，有領先的趨勢。透過奈米壓痕分析，Al52Ag31Cu17非晶態薄膜硬度最高到達了6.11GPa之硬度與111.83GPa之楊氏模數，而Al65Ag15Cu20複合結構到達了3.75GPa之硬度與95.37之楊氏模數。非晶質膜的硬度相比於純金膜高出了4倍之多。本研究證明了此方案的可行性，AlAgCu金屬薄膜具有極大的潛力。 ;With the advancement of 3C products and Industry 4.0, the connector industry has also been growing. More and more research is focusing on improving the performance of connectors at a lower cost now. Traditionally, terminals connector enhance their bonding with the outer layer by first coating with a layer of pure nickel as a base, followed by a layer of pure gold. However, since the prices of nickel and gold are very high, the overall cost continually increases. As a result, domestic and international connector manufacturers are turning to the development and research of alternative coating materials to replace the nickel and gold parts. In commercial, terminals connector must possess characteristics such as impact resistance, durability under repeated insertion and removal, low electrical resistance, high-temperature resistance and moisture resistance. Consequently, improving the mechanical, electrical, and environmental properties of terminals connector are the core topics. This study try to develop the aluminum-silver-copper (Al-Ag-Cu) amorphous alloys and use this amorphous alloys to fabricate a thin film to replace the expensive pure gold and pure nickel films. In this study the alloy is coated onto glass substrates to form an amorphous structure film by using DC magnetron sputtering, and then investigate the mechanical properties, electrical conductivity, and corrosion resistance of these thin film. Compared with conventional crystalline structures, amorphous structure possess higher hardness and wear resistance. Additionally, due to the absence of grain boundaries, they exhibit extremely strong oxidation resistance and corrosion resistance. When applied to thin films, these properties can effectively address existing issues. The results show that the aluminum-silver-copper (Al-Ag-Cu) based alloy can be successfully deposited onto glass substrates using DC magnetron sputtering. XRD results show that after the deposition the Al-Ag-Cu based alloy retains its amorphous structure. Rapid thermal annealing at 400℃was performed after deposition, and the resistivity of thin film were measured. The resistivity of the Al46Ag35Cu19 amorphous film reduces to as low as 98 μΩ∙cm, while the Al70Ag15Cu15 composite structure reduces to 39 μΩ∙cm. Compared with pure copper at 42 μΩ∙cm and pure nickel at 141 μΩ∙cm, these results show a promising trend. Through nano-indentation analysis, it was found that the Al52Ag31Cu17 amorphous film achieved a maximum hardness of 6.11 GPa and a Young′s modulus of 111.83 GPa. Meanwhile, the Al65Ag15Cu20 composite structure reached a hardness of 3.75 GPa and a Young′s modulus of 95.37 GPa. The hardness of the amorphous film is four times higher than that of pure gold film. This study demonstrates the feasibility of this approach, showing that AlAgCu metal thin films have great potential.
Appears in Collections:	[Graduate Institute of Mechanical Engineering] Electronic Thesis & Dissertation

Files in This Item:

File	Description	Size	Format
index.html		0Kb	HTML	13	View/Open

社群 sharing

Loading...