目前於石英晶圓上製作方形微通孔非常困難，因為石英材料具有硬而脆之特性，而採用銑削加工微形方孔時，會導致石英晶圓破裂，造成產品品質不佳等問題，本研究主要係採用電化學放電複合超音波振動輔助電泳沉積加工石英晶圓微形方孔，於實驗的過程中，採用線放電研磨加工(Wire Electrical Discharge Grinding，WEDG)製成之碳化鎢二階式工具電極進行電化學放電加工微形方孔，接著，再進行超音波振動輔助電泳沉積修整加工，除解決電化學放電加工後，微形方孔之形貌及加工精度不佳的問題外，同時亦能降低電極製作成本。本研究於實驗中，藉由調整各項加工參數進行單因子參數實驗，並探討各項加工參數如工作電壓、電泳濃度、進給速度及超音波功率等級對於石英晶圓微形方孔加工之各種品質特性的影響，品質特性包含微形方孔之入、出口邊長平均值、入、出口表面形貌、出口破片情況及二階式工具電極寬度消耗之情形。 採用電化學放電複合超音波振動輔助電泳沉積加工石英晶圓微形方孔時，於電泳效應的幫助下，磨料會聚集在二階式工具電極周圍，形成研磨工具，於超音波振動輔助下，藉由研磨工具修整微形方孔，可獲得較佳之微形方孔之入、出口表面形貌，實驗結果顯示，利用電泳沉積磨料修整加工來進行石英晶圓的微形方孔加工時，於工作電壓2V、磨料濃度10wt.%、第二階段進給速度1μm/5sec及超音波功率等級Level 5為本研究較佳參數組合，並可得到微形方孔加工後之入口邊長平均值為99μm，微形方孔之出口邊長平均值為93μm，且微形方孔之表面形貌較佳。 ;At present, it is very difficult to make square micro holes on quartz wafers. Because the quartz material is hard and brittle. Milling micro square holes may break the quartz wafer, resulting in poor product quality. This study combined electrochemical discharge with ultrasonic vibration-assisted electrophoresis deposition to process micro square holes on the quartz wafers. During the experiment, the tungsten carbide two-stage tool electrode made by Wire Electrical Discharge Grinding (WEDG) was used for electrochemical discharge machining of micro square holes. Afterwards, the ultrasonic vibration-assisted electrophoresis deposition trimming was performed. The problem of poor morphology and processing accuracy of micro square holes after electrochemical discharge machining was solved, and the electrode fabrication cost was reduced. In the experiment, various processing parameters were adjusted for the single-factor parameter experiment. The influence of various processing parameters such as working voltage, electrophoresis concentration, feed rate and ultrasonic power level on various quality characteristics of micro square holes processing on the quartz wafers. The quality characteristics included the hole average width of the entrance and exit side lengths of the micro square hole, the entrance and exit surface morphologies, the exit fragmentation and the two-stage tool electrode width wear. When the electrochemical discharge combined with ultrasonic vibration-assisted electrophoresis deposition was used to process micro square holes in a quartz wafer. Under the electrophoretic effect, the abrasives gathered around the two-stage tool electrode to form a grinding tool. Using ultrasonic vibration, the micro square holes were trimmed with the grinding tool, better entrance and exit surface morphologies of the micro square holes were obtained. The experimental results show that when the electrophoresis deposition abrasive finishing was used to process micro square holes in quartz wafers, the better parameter combination in this study consisted of working voltage 2V, abrasive concentration 10wt.%, Stage 2 feed rate 1μm/5sec and ultrasonic power Level 5. The entrance micro square holes average width was 99μm after the processing, and the exit micro square holes average width was 93μm after the processing. The micro square holes have better surface morphology.
