電化學結合電泳精密拋光不銹鋼之研究

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姓名

崔海平(Hai-Ping TSUI) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

電化學結合電泳精密拋光不銹鋼之研究
(A study on stainless steel machining by using Electro-chemical machining with precise electrophoretic deposition polishing.)

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摘要(中)

機械加工後之表面粗糙度改善，常需借助拋光製程來完成，但具微細尺寸磨粒之拋光磨輪由於製造上之困難性，磨粒粒徑1~2 μm以下之拋光磨輪較難製造。當具較大尺寸磨粒之拋光磨輪被應用於拋光製程時，所產生之拋光痕較寬，致使吾人無法獲得鏡面加工之效果，另微小孔洞經機械加工後，微小孔洞內壁之鏡面拋光，因孔徑微小，目前尚未有低成本及簡易之拋光方法。因此，如何鏡面拋光機械加工後表面及提升加工品質，是本論文所要探討的主題。
本研究針對不銹鋼材料表面粗糙度改善及提升加工品質，提出了三種改善方法，分別為電泳沉積鏡面拋光、精微螺旋電極電化學鑽孔加工及電化學結合電泳微孔複合加工。經由實驗結果分析顯示，電泳沉積法進行表面拋光，使用SiC粒徑顆粒大小為0.9~1.5 μm，可將Ra 0.5 μm的車削面及Ra 1.67 μm的放電面分別改善至Ra 0.03 μm及Ra 0.05 μm的鏡面;另一種方法為採用精微螺旋電極進行電化學鑽孔加工，電化學加工反應生成物能有效排出至加工區域外，可將圓柱電極加工後之入口孔徑425 μm與出口孔徑362 μm分別降為335 μm及299 μm，有效改善電化學鑽孔加工後的微孔形狀精度；第三種方法為電化學結合電泳微孔複合加工，係於精微螺旋電極表面電泳沉積SiC磨粒而製成微複合工具，並使用該微複合工具同時施行微電化學鑽孔加工及微孔洞研磨之複合加工，可將精微螺旋電極電化學鑽孔加工之Ra 0.4 µm降至Ra 0.041 µm，對改善表面粗糙度效果相當明顯。

摘要(英)

Surface roughness of the machined parts can be improved by polishing process. Nevertheless, manufacturing polishing wheels with micro abrasive grains, especially those smaller than 1~2 μm, is extremely difficult. When polishing wheels with larger abrasive grains are used in polishing, the polishing marks on the surface of the specimen are wider. The mirror-like surface can not easily obtained. It is more difficult to polish the machined micro holes. In view of such drawbacks, this study aims to enhance the surface quality and precision of machined parts.
In this study, three approaches improve the surface roughness and machining precision of stainless steel plate are proposed. Three approaches are the mirror surface polishing by using the electrophoretic deposition method, Electro-chemical micro drilling (ECMD) by using helical tool, ECMD and Electrophoretic Deposition (EPD) polishing complex micro-hole machining. For the first approach, the experimental results indicate not only that SiC particles of size 0.9~1.5 µm were used in EPD polishing, but also that the initial roughness of the turning and the EDM machined surface could be improved from 0.5 µm Ra and 1.67 µm Ra to 0.03 µm Ra and 0.05μm Ra respectively. The second approach using a micro helical tool as a novel solution in ECMD process to improve the machining accuracy. The reaction products can be squeezed out of the machining zone. The inlet and outlet diameters of the micro holes could be improved from 425 μm and 362 μm using micro cylindrical tool to 355 μm and 299 μm respectively. Finally, ECMD and EPD polishing complex micro-hole machining experiment was performed. The micro helical tool can be deposited with SiC particles in Phenolic Formaldehyde Resin solution as a hybrid micro-tool by electrophoretic deposition phenomenon. The hybrid micro-tool is used in ECMD and EPD polishing complex micro-hole machining.experiments. When the helical tool is used, the inner surface roughness of micro hole is 0.4 µm Ra. When the hybrid micro-tool is used, the inner surface roughness of micro hole declines markedly to 0.041 µm Ra. The inner surface roughness of micro hole can be significantly improved.

關鍵字(中)

★ 拋光磨輪
★ 鏡面拋光
★ 電泳沉積
★ 電化學鑽孔
★ 微複合工具
★ 不銹鋼

關鍵字(英)

★ stainless steel
★ electrophoretic deposition
★ hybrid micro-tool
★ mirror surface polishing
★ polishing wheel
★ electrochemical drilling

論文目次

目錄
中文摘要 I
英文摘要 II
謝誌 IV
目錄 V
圖目錄 VIII
表目錄 XII
第一章緒論 1
1-1 研究背景 1
1-2 研究動機與目的 3
1-3 文獻回顧 6
1-3-1應用電泳沈積法於表面拋光技術 6
1-3-2微電化學加工技術 7
1-4 研究方法 15
1-5 本論文之構成 17
第二章電泳沉積鏡面拋光之研究 18
2-1 前言 18
2-2電泳沉積加工之原理 19
2-2-1 電雙層理論 19
2-2-2 電動力學現象 20
2-2-3 粉體粒子表面電荷來源 23
2-2-4 電泳沈積法之原理 24
2-2-5 電泳沈積之方式與沈積速率 25
2-3 實驗設定 27
2-3-1 實驗設備 27
2-3-2 實驗材料 30
2-3-3 實驗流程與方法 35
2-4 結果與討論 42
2-4-1電泳沉積法應用於車削面拋光之參數影響探討 42
2-4-1-1拋光時間對表面粗糙度的影響 42
2-4-1-2軸向荷重對表面粗糙度的影響 43
2-4-1-3磨輪轉速對表面粗糙度的影響 45
2-4-1-4 拋光進給速率對表面粗糙度的影響 46
2-4-1-5工作電壓對表面粗糙度的影響 48
2-4-1-6車削面試片拋光後之表面形貌觀察 49
2-4-2 電泳沉積法應用於放電面拋光之參數影響探討 51
2-4-2-1拋光時間對表面粗糙度的影響 51
2-4-2-2軸向荷重對表面粗糙度的影響 53
2-4-2-3磨輪轉速對表面粗糙度的影響 54
2-4-2-4拋光進給速率對表面粗糙度的影響 55
2-4-2-5工作電壓對表面粗糙度的影響 57
2-4-2-6放電面試片拋光後之表面形貌觀察 58
2-4-2-7電泳沉積機制之有無對表面拋光影響比較 60
2-5 結論 64
第三章微電化學鑽孔加工特性之研究 65
3-1 前言 65
3-2 基本原理 66
3-2-1電化學加工基本原理 66
3-2-1-1法拉第定律 66
3-2-1-2 歐姆定律 67
3-3 實驗設定 68
3-3-1 實驗設備 68
3-3-2 實驗材料 70
3-3-3 實驗流程與方法 72
3-4 結果與討論 75
3-4-1 螺旋電極與圓柱電極之微電化學鑽孔加工結果之差異 75
3-4-2 精微螺旋電極實行於電化學鑽孔加工之參數影響探討 75
3-4-2-1工作電壓對內孔形狀精度的影響 76
3-4-2-2電極轉速對內孔形狀精度的影響 78
3-4-2-3電解液濃度對內孔形狀精度的影響 80
3-4-2-4脈衝時間對內孔形狀精度的影響 81
3-4-2-5螺旋電極正轉及反轉對內孔形狀精度的影響 86
3-5 結論 87
第四章電化學結合電泳微孔複合加工之研究 88
4-1 前言 88
4-2 實驗設定 89
4-2-1 實驗設備 89
4-2-2 實驗材料 91
4-2-3 實驗流程與方法 93
4-3 結果與討論 98
4-3-1電泳沉積微複合工具之參數影響探討 98
4-3-1-1披覆電壓對沉積後直徑的影響 98
4-3-1-2披覆時間對沉積後直徑的影響 100
4-3-1-3電極轉速對沉積後直徑的影響 101
4-3-1-4 SiC濃度對沉積後直徑的影響 102
4-3-2 微孔複合加工結果探討 104
4-4 結論 108
第五章總結論 109
參考文獻 112

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指導教授

顏炳華(Biing Hwa Yan)

審核日期

2008-6-21

推文