參考文獻 |
[AVI]R. R. de Avillez, M. F. S. Lopes and A. L. M Silva,
J. Mater. Sci. Eng A, 205, p.209, 1996.
[BAD]S. Bader, W. Gust and H. Hieber, Acta Metall. Mater,
43, p.329, 1995.
[BAK]H. Baker, ASM Handbook v.3: Alloy Phase Diagrams,
ASM, Materials Park, OH, p.2355, 1992.
[BLA1]H. D. Blair, T. Y. Pan and J. M. Nicholson, IEEE 1998
Electronic Components and Technology Conference,
p.259, 1998.
[BLA2]H. D. Blair, T. Y. Pan, and J. M.Nicholson, IEEE/CPMT
International Electronics Manufacturing Technology
Symposium, p.282, 1996.
[CHE]C. P. Chen and Y. A. Chang, Diffusion in Ordered
Alloys, ed. B. Fultz, R. W. Cahn, And D. Gupta, TMS,
Warrendale, PA, p.168, 1993.
[DUC]O. V. Dunchenko and V. I. Dybkov, J. Mater. Sci.
Lett., 14, p.1725, 1995.
[DYB]V. I. Dybkov and O. V. Dunchenko, J. Alloys and
Compounds, 234, p.295, 1996.
[GLA]J. Glazer, Int. Mater. Rev., 40, p.65, 1995.
[GUP]Y. P. Gupta, The Properties of Liquid Metals,
reprints from Adv. Phys., 16, 1967. Taylor & Francis,
London.
[GUR]D. Gur and M. Bamberger, Acta Meter., 46, p.4917,
1998.
[HAI]J. Haimovich, AMP Journal of Technology, 3, p.46,
1993.
[HO]C. E. Ho, Y. M. Chen, and C. R. Kao, “Dissolution
and reaction kinetics of the solder-ball pads in BGA
during refolw soldering,” submitted to Journal of
Electronic Materials.
[KAN1]S. K. Kang and V. Ramachandran, Scripta Metall., 14,
p.421, 1980.
[KAN2]S. K. Kang, R. S. Rai and S. Purushothaman, J.
Electron. Mater., 25, p.1113, 1996.
[KAO1]C. R. Kao, Mater. Sci. Eng. A, 238, p.196, 1997.
[KAO2] C. R. Kao, Ph. D Theses, University of Wisconsin-
Madison, 1994.
[KAW]I. Kawakatsu, T. Osawa, and H. Yamaguchi,
Transactions of Japan Institute of Metals, 13, p.436,
1972.
[KAY]P. J. Kay and C. A. Mackay, Transactions of the
Institute of Metal Finishing, 57, p.169, 1979.
[KUM]K. Kumar, A. Mosscaritolo, M. Brownawell, J.
Electrochem. Soc.:Electrochemical Science and
Technology, 128, p.2165, 1981.
[LEE1]M. S. Lee, C. M. Liu and C. R. Kao, J. Electron.
Mater., 28, p.57, 1999.
[LEE2]M. S. Lee, C. Chen and C. R. Kao, J. Chem. Mater.,
11, p.292, 1999.
[Loo]F. J. J. van Loo and G. D. Reick, Acta Metall., 21,
p.61, 1973.
[MA]C. H. Ma and R. A. Swalin, Acta Meter., 8, p.388,
1960.
[MAS]T. B. Massalski et al. (eds.): Binary Alloy Phase
Diagrams, 1-2, 2nd edn, 1990. Materials Park, OH, ASM
International.
[MFG]Soldering, in Circuits MFG, p.17, 1980.
[MOR]J. E. Morris, Workshop “The Design and Processing
Technology of Electronic Packaging”, 1997.
[NAS1]P. Nash, Bulletin of Alloy Phase Diagram, 8, p.264,
1987.
[NAS2]P. Nash, Bulletin of Alloy Phase Diagram, 6, p.350,
1985.
[NAS3]P. Nash, Bulletin of Alloy Phase Diagram, 6, p.345,
1985.
[RAH]A. Rahn, The Basics of Soldering, John Wiely & Sons,
1993, New York.
[PAN]T. Pan, H. D. Blair, D. Mitlin, G. M. Crosbie, J. M.
Nicholson, and J. Hangas, ASME International
Mechanical Engineering Conference and Exposition,
p.12, 1996.
[PAR]J. O. G. Parent, D. D. L. Chung, and I. M. Bernstein,
J. Mater. Sci., 23, p.2564, 1988.
[REV]L. Revay, Surface Technology, 5, p.57, 1977.
[TWT]J. H. Lau, Ball Grid Array (BGA) and Chip Scale
Package (CSP) Course, Technical Programs for the
Semiconductor and Flat Panel Display Equipment and
Materials Industries, SEMICON Taiwan, 1996.
[UNS]D. A. Unsworth, and C. A. Mackay, Transactions of the
Institute of Metal Finishes, 51, p.85, 1973.
[VIA]P. T. Vianco, K. L. Erickson, and P. L. Hopkins, J.
Electron. Mater., 23, p.721, 1994.
[WAR]M. E. Warwick and S. J. Muckett, Circuit World, 9,
p.5, 1983.
[WAS]R. J. Wassink, Soldering in Electronics, 2nd ed.,
Electrochemical Pub. Ltd., p.523, 1989.
[WIL]R. W. Wild, Technical Report 171200408, IBM Federal
System Division Laboratory, Owego, NY, 1971.
[WOO]E. P. Wood and K. L. Nimmo, J. Electron. Mater., 23,
p.709, 1994.
[WU]Y. Wu, J. A. Sees, C. Pouraghabagher, L. A. Foster,
J. L. Marshall, E. G. Jacobs, and R. F. Pinizzotto, J.
Electron. Mater., 22, p.769, 1993.
[李明勳]李明勳碩士論文,國立中央大學化學工程研究所,1998。
[陳 琪]陳琪碩士論文,國立中央大學化學工程研究所,1998。
[劉家明]劉家明碩士論文,國立中央大學化學工程研究所,1999。
[陳秋雲]陳秋雲,VLSI製造技術,全華科技圖書股份有限公司,台灣, 1998 |