參考文獻 |
[ALL] J. Alloy Phase Diagrams, Vol. 4, No. 3, pp. 160-174, 1988.
[AVI] R. R. de Avillez, M. F. S. Lopes and A. L. M Silva, J. Mater. Sci. Eng A, 205, p. 209, 1996.
[BAD] S. Bader, W. Gust and H.Hieber, “Rapid Formation of Intermetallic Compounds by Interdiffusion in the Cu-Sn and Ni-Sn Systems”, Acta Metallurgica et Materialia, Vol. 43(1), pp. 329-337, 1995.
[BAK] H. Baker, ASM Handbook v.3: Alloy Phase Diagrams, ASM, Materials Park, OH, p. 2355, 1992.
[BAN] K. Banerji and R. F. Darveaux, in Microstructures and Mechanical Properties of Aging Materials, ed. P. K. Liaw, R. Viswanathan, K. L. Murty, E. P. Simonen, and D. Frear, (Warrendale, PA: TMS), p. 431., 1993.
[BAR] F. Bartels and J. W. Morris, JR., Journal of Electronic Materials, Vol. 23(8), pp. 787-790, 1994.
[BEE] J. A. van Beek, S. A. Stolk and F. J. J. van Loo, Z Metallkde, 73, p. 441, 1982.
[BLA] H. D. Blair, T. Pan and J. M. Nicholson, Electronic Components and Technology Conference, 6, p. 259, 1998.
[BRA] E. Bradley, K. Snowdon and R. Gedney, “Lead-Free Update”, Circuits Assembly, Dec., pp. 30-33, 1999.
[CHA1] D. J. Chakrabarti, D. E. Laughlin, S. W. Chen, Y. A. Chang, in “ASE Handbook Vol.3 Alloy Phase Diagrams”, ed. by H. Baker, ASE International, Materials Park, Ohio, pp. 2-173, 1992.
[CHA2] D. J. Chakrabarti, D. E. Laughlin, S. W. Chen, Y. A. Chang, in “Binary Alloy Phase Diagrams”, ed. by Thaddeus B. Massalski, ASE International, Materials Park, Ohio, Vol.2, pp. 1442-1446, 1990.
[CHE] Y. C. Chen, S. J. Lee and C. C. Lee, “High Temperature Cu-Sn Joints Manufactured by a 250℃ Fluxless Bonding Process”, IEEE Trans. on CPMT, 5, pp. 206-210, 1994.
[CRU] S. Crum, “Targeting Lead-Free Solutions”, EP&P, June, pp. 28-35, 1999.
[DAR] R. F. Darveaux, K. Banerji, A. Mawer, and G. Dody, in Ball Grid Array Technology, ed. J. K. Lau, (New York, McGraw-Hill), p. 379., 1995.
[EAS] J. T. Eash and C. Upthegrove, Transactions of the American Institute of Mining, Metallurgical and Petroleum Engineers (Transactions AIME), p. 221-249, 1933.
[ERN] C. Ernhart and S. Scarr, presented at the ACYF research conference, New Directions in Child and Family Research, 1991.
[FRE] D. R. Frear, J. W. Jang, J. K. Lin, and C. Zhang, JOM, June, 28, 2001.
[GLA1] J. Glazer, Int. Mater. Rev., 40, p. 65, 1995.
[GUP] K. P. Gupta, Indian Institute of Metals, Vol. 1, pp. 195-218, 1990.
[GUR] D. Gur and M. Bamberger, Acta Meter., 46, p. 4917, 1998.
[HAH] T. Hahn, International Tables for Crystallography, 3rd ed., KAP, Boston, 1992.
[HAI] J. Haimovich, Welding Research Supplement, Vol. 68(3), pp. 102s-111s, 1989.
[HAN] Handbook of Ternary Alloy Phase Diagrams, pp. 9818-9837.
[HAY] A. Hayashi, C. R. Kao and Y. A. Chang, “Reactions of Solid Copper with PureLiquid Tin and Liquid Tin saturated with Copper”, Scripta Materialia, Vol. 68(3), pp. 37(4), pp. 393-398, 1997.
[HO1] C. E. Ho, Y. M. Chen, and C. R. Kao, “Reaction kinetics of solder-balls with pads in BGA during reflow soldering,” J. Electron. Mater., 28, p. 1231, 1999.
[HO2] C. E. Ho, Y. L. Lin, and C. R. Kao, “Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni,” Chemistry of Materials, 14(3), p. 949, 2002.
[HO3] C. E. Ho, R. Zheng, G. L. Luo, A. H. Lin, and C. R. Kao, “Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish,” J. Electron. Mater., vol. 29, pp. 1175-1181, 2000.
[HOW] R. T. Howard, “Optimization of Indium-Lead Alloys for Controlled CollapseChip Connection Application”, IBM J. RES. Develop., 26, pp. 36-40., 1982.
[KAN1] S. K. Kang and V. Ramachandran, Scripta Metall., 14, p. 421, 1980.
[KAN2] S. K. Kang, R. S. Rai and S. Purushothaman, J. Electron. Mater., 25, p. 1113, 1996.
[KAO1] C. R. Kao, Mater. Sci. Eng. A, 238, p. 196, 1997.
[KAO2] C. E. Kao,「清潔生產研討會」講義,中央大學,p. 18, 2001。
[KAO3] C. R. Kao, “Microstructures Developed in Solid-liquid Reactions: Using Cu-Sn Reaction, Ni-Bi Reaction and Cu-In Reaction as Examples”, Materials Science and Engineering, 238, pp. 196-201, 1997.
[KIM1] H. K. Kim, H. K. Liou and K. N. Tu, J. Appl. Phys. Lett., 66, p. 2337, 1995.
[LAU] J. H. Lau, “Flip Chip Technologies”, McGraw-Hill, New York, 1995.
[LEE1] M. S. Lee, C. M. Liu and C. R. Kao, J. Electron. Mater., 28, p. 57, 1999.
[LEE2] N. C. Lee,「1998先進電子封裝技術趨勢研討會」講義,新竹,p. 81,1998。
[LEE3] N. C. Lee, Soldering and Surface Mount Tech., 6, p. 65, 1997.
[LEE4] J. S. Lee and K. Mukherjee, Materials Science and Engineering, A117, pp. 167-173, 1989.
[LEE5] C. C. Lee, C. Y. Wang and G. Matijasevic, “A Fluxless Oxidation-Free Bonding Technology U”, IEEE Trans. on CPMT, 3, (1994), pp. 595-599.
[MA] C. H. Ma and R. A. Swalin, Acta Meter., 8, pp. 388, 1960.
[MAR] Z. Marinkovic and V. Simic, Thin Solid Films, Vol. 98, pp. 95-100, 1982.
[MAT] G. Matijasevic, Y. C. Chen and C. C. Lee, “Copper-Tin Multilayer Composite Solder for Fluxless Processing”, The International Journal of Microcircuits and Electronic Packaging, 17, pp. 108-117, 1994.
[MEI] Z. Mei, M. Kaufmann, A. Eslambolchi, and P. Johnson, “Brittle interfacial fracture of PBGA packages soldered on electroless Nickel/immersion gold,” 1998 Electron. Comp. Tech. Conf. Proceeding, pp. 952-961, 1998.
[MFG] Soldering, in Circuits MFG, pp. 17, 1980.
[MIK] M. Miki and Y. Ogin, Transactions of the Japan Institute of Metals, Vol. 25, No. 9, pp. 593-602, 1984.
[MIN] M. L. Minges et al., “Packaging”, Electronic Materials Handbook, Vol. 1, ASM International, Materials Park, Ohio, 1989.
[MUL] Multicore Company, Which Solder? Which Flux? Product Detail, (www.multicore.com).
[MUR1] Y. Murakami, Y. Watanabe, T. Kanaizuka and S. Kachi, Transactions of the Japan Institute of Metals, Vol. 22, No. 8, pp. 551-557, 1981.
[MUR2] Y. Murakami and S. Kachi, Transactions of the Japan Institute of Metals, Vol. 24, No. 1, pp. 9-17, 1983.
[NAS1] P. Nash and A. Nash, in “ASE Handbook Vol.3 Alloy Phase Diagrams”, ed. by H. Baker, ASE International, Materials Park, Ohio, pp. 2-318, 1992.
[NAS2] P. Nash and A. Nash, in “Binary Alloy Phase Diagrams”, ed. by Thaddeus B. Massalski, ASE International, Materials Park, Ohio, Vol.3, pp. 2863-2864, 1990.
[PLU] W. J. Plumbridge, J. Mater. Sci,. 31, p. 2501, 1996.
[RAB] J. D. Raby and R. W. Johnson, “Is a Lead-Free Furture Wishful Thinking ?”,EP&P, August, pp. 18-20, 1999.
[RAH] A. Rahn, The Basics of Soldering, John Wiely & Sons, New York, 1993.
[RID] E. Rideout, 1994 IEEE/CPMT Int. Elect. Manufact. Tech. Symp., pp. 388, 1994.
[SAU1] N. Saunders and A. P. Miodownik, in “ASE Handbook Vol.3 Alloy Phase Diagrams”, ed. by H. Baker, ASE International, Materials Park, Ohio, pp. 2-166, 1992.
[SAU2] N. Saunders and A. P. Miodownik, in “Binary Alloy Phase Diagrams”, ed. by Thaddeus B. Massalski, ASE International, Materials Park, Ohio, Vol.2, pp. 1481-1483, 1990.
[SEN] Senate Bills S.729 and S.2637 by Senator Reid; House Bills H.2479 and H.2922 by Representative Cardin.
[SER] D. P. Seraphim, R. C. Lasky and C-Y. Li, “Principle of Electronic Package”, McGraw-Hill, New York, 1993.
[SHI] K. Shimizu, T. Nakanishi, K. Karasawa, K. Hashimoto and K. Niwa, “SolderJoint Reliability of Indium-Alloy Interconnection”, J. Elect. Mat., .24, pp. 39-45, 1996.
[SO] A. C. K. So, Y. C. Chan and J. K. L. Lai, “Aging Studing of Cu-Sn Intermetallic Compounds in Annealed Surface Mount Solder Joints”, IEEE Trans. Comp. Packg. Manuf. Tech. B, 20, pp. 161-166, 1997.
[TU1] K. N. Tu, “Interdiffusion and Reaction in Bimetallic Cu-Sn Thin Films”, Acta Metall., 21, pp. 347-354, 1973.
[TU2] K. N. Tu, “Kinetics of Interfacial Reaction in Bimetallic Cu-Sn Thin Films”, Acta Metall., 30, pp. 947-952, 1982.
[TU3] K. N. Tu, “Cu/Sn Interfacial Reactions: Thin-Film Case Versus Bulk Case”, Mat. Chem. and Phys., 46, pp. 217-223, 1996.
[TUM1] R. R. Tummala, E. J. Rymaszewski, “Microelectronics Packaging Handbook”, Van Nostrand Reinhold, 1989.
[TUM2] R. R. Tummala, E. J. Rymaszewski and A. G. Klopfenstein, “Microelectronics Packaging Handbook”, Chapman, New York, 1997.
[VAR] J. Vardaman, “What’s Driving the Lead-Free Movement ?”, EP&P, Nov., p. 76, 1999.
[VES] J. Veszelka, Mitt. Berg. U. Hutt. Abt. K. Ung. Hochschule Berg. U. Forstwesen, Vol. 4, pp. 163-185, 1932.
[VIA] P. T. Vianco, P. F. Hlava and A. C. Kilgo, “Intermetallic Compound Layer Formation between Copper and Hot-Dipped 100In, 50In-50Sn, 100Sn and 63Sn-37Pb Coatings”, Journal of Electronic Materials, 23, pp. 583-594, 1994.
[VIL] P. Villars and L. D. Calvert, Pearson’’s Handbook of Crystallographic Data for Intermetallic Phases, ASM International, Materials Park, OH, 1991.
[VUO] V. Vuorinen, P. Obersdorf, F. J. J. van Loo, and J. K. Kivilahti (unpublished research).
[WAC] E. Wachtel and E. Bayer, Zeitschrift fuer Metallkunde, Vol. 75(1), p. 61-69, 1984.
[WAS1] R. J. Wassink, Soldering in Eelectronics, Electrochemical Pub. Ltd., p. 99, 1984.
[WAS2] R. J. Wassink, Soldering in Eelectronics, 2nd ed., Electro-chemical Pub. Ltd., p. 523, 1989.
[WHI] C. E. T. White, “Indium : High-Technology Metal”, Advanced Materials &Processes inc. Metal Progress, 69-72, 1997.
[孔令臣] 孔令臣,“覆晶凸塊技術”,工業材料,139, p. 155, 1998。
[何政恩1] 何政恩、高振宏,中國材料學會1998年年會論文集,[H],p. 730, 1998。
[何政恩2] 何政恩、蕭本俐、高振宏,中國材料學會1999年年會論文集,H43, 1999。
[何政恩3] 何政恩博士論文,國立中央大學化工所,2002。
[呂宗興] 呂宗興,電子構裝技術的發展歷程,工業材料115期,p. 49, 1996。
[李明勳] 李明勳碩士論文,國立中央大學化工所,1998。
[李柔儀] 李柔儀碩士論文,國立清華大學化工所,2001。
[林安宏] 林安宏碩士論文,國立中央大學化工所,2001。
[林志豪] 林志豪碩士論文,國立清華大學化工所,2001。
[洪敏雄] 洪敏雄、游善溥,電子構裝用無鉛焊錫,科儀新知,第20卷第2期,pp. 57-66, 1998。
[高振宏] TPCA教育訓練課程,Solder Bump Technologies, 2002。
[徐敏雯] 徐敏雯碩士論文,國立中央大學化工所,2001。
[陳琪] 陳琪碩士論文,國立中央大學化工所,1999。
[張俊彥] 張俊彥,鄭晃忠,”積體電路製程及設備技術手冊”,中華民國電子材料與元件協會等出版,pp. 7-85, 1998。
[溫啟宏] 溫啟宏, “蛻變中的台灣封裝業”, 工業材料,139, pp. 92-96, 1998。
[劉家明] 劉家明碩士論文,國立中央大學化工所,2000。
[劉益銘] 劉益銘博士論文,國立台灣大學材料所,2000。
[賴玄金] 賴玄金, “從IPC Work’99 會議看無鉛銲錫電子構裝之應用現況與發展趨勢”,工業材料, 158, pp. 99-107, 2000。
[蕭麗娟] 蕭麗娟碩士論文,國立中央大學化工所,2002。
[羅金龍] 羅金龍碩士論文,國立中央大學化工所,2001。 |