印刷電路板無鹵素膠片壓合製程最佳化之研究

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姓名

王錦祥(Chin-Hsiang Wang) 查詢紙本館藏

畢業系所

化學工程與材料工程學系

論文名稱

印刷電路板無鹵素膠片壓合製程最佳化之研究
(The optimum combination for Printed Circuit Board without halogen free prepreg lamination process)

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摘要(中)

本文利用田口實驗設計法來規劃實驗，再藉由SN比，尋找印刷電路板無鹵素膠片壓合製成最佳化之壓合條件，以達可以快速得到所需求的品質目標。
實驗設計採用田口方法中的L9直交表，選擇壓合壓力、壓合溫度、壓合時間及升溫速率為控制因子，每一因子皆選擇三個水準，其品質目標則是拉力強度(Peeling Strength)；以玻璃轉移溫度變化量(△Tg)與熱膨脹係數(CTE)做為評估的指標並決定影響各品質最鉅的控制因子。
實驗的結果選擇壓合時間為60min、壓合溫度為190℃、壓合壓力為250psi與升溫速率為1.2℃/min，玻璃轉移溫度變化量(△Tg)為4.42℃、高溫熱膨脹係數(α2)為294.40 μm/(m．℃)與影響最鉅的控制因子為壓合溫度。

摘要(英)

This research is to conduct the experiment by using Takuchi Methods. The Singnal to Noise Ratios is also used to figure out the optimum combination for Printed Circuit Board without halogen free prepreg lamination process, which can facilitate to reach the required quality target.
This experiment adopted L9(34) orthogonal array. We selected the lamination time, lamination temperature, lamination process and heat rate
as the control factors.3 degree levels have been set for each factor to each the quality target of peeling strength；delta glass transition temperature (△Tg) and coefficient of thermal expansion (CTE) are valuation target which is selected as the best effect control factor.
The result experiment shows that the delta glass transition temperature (△Tg) is 4.42℃ and the high temperature coefficient of thermal (α2) is 294.40 μm/(m．℃) when selected lamination time is 60min, lamination temperature is 190℃, lamination pressure is 250psi and heat rate is 1.2℃/min. Besides, the best effect control factor is lamination temperature.

關鍵字(中)

★ 印刷電路板壓合製程
★ 無鹵素膠片
★ 田口法
★ 玻璃轉化溫度變化量(△Tg)
★ 熱膨脹係數(CTE)

關鍵字(英)

★ Printed Circuit Board lamination process
★ halogen free prepreg
★ Takuchi Methods
★ delta glass transition temperature
★ coefficient of thermal

論文目次

目錄
中文摘要.................................. i
英文摘要......................... .........ii
誌謝............................... .........iii
目錄............................... .........iv
圖目錄............................ .........vi
表目錄............................ .........ix
第一章緒論........................ .........1
1.1 研究背景....................... .........1
1.2 研究目的....................... .........7
1.3 研究方法....................... .........8
1.4 研究架構....................... .........10
第二章文獻回顧.................... .........12
2.1 銅箔基板基材介紹............... .........12
2.1.1 銅箔(Cooper Foil)............. .........13
2.1.2 環氧樹脂(Epoxy)............... .........16
2.1.3 玻璃纖維布(Fiberglass)................. 22
2.2 銅箔與膠片間化學性質與物理結構.......... 25
2.2.1 膠片的化學組成......................... 25
2.2.2 銅箔表面之催化劣反應................... 26
2.2.3 銅表面對高分子的選擇性吸附............. 27
2.2.4 銅表面之環氧樹脂/DICY硬化反應.......... 28
第三章壓合製程概述與田口實驗設計法......... 30
3.1 壓合製程概述............................ 30
3.2 田口法(Taguchi Method).................. 32
3.2.1 田口法基本觀念......................... 33
3.2.2 直交表................................. 34
3.2.3 品質影響因子............................36
3.2.4 品質損失函數............................37
3.2.5 信號雜音比..............................41
第四章實驗規劃與方法........................43
4.1 壓合製程最佳化在田口法之因素及水準.......43
4.2 壓合實驗材料.............................45
4.2 儀器設備.................................46
4.3 壓合條件擬定.............................48
4.4 試驗方法.................................49
4.4.1 拉力強度試驗(Peeling Strength)..........49
4.4.2 玻璃轉移溫度變化量(△Tg)實驗............49
4.4.3 熱膨脹係數(CTE).........................49
第五章實驗結果與討論........................51
5.1 田口實驗法之結果.........................51
5.2 玻璃轉移溫度變化量(△Tg)之實驗結果.......53
5.3 熱膨脹係數(CTE)實驗之結果................64
第六章結論與未來研究方向....................74
6.1 結論 .....................................74
6.2 未來研究方向.............................75
參考文獻...................................76

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指導教授

陳銘如、陳登科(Teng-Ko Chen)

審核日期

2008-6-23

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