石墨烯與奈米石墨嵌入式熱介面材料與散熱應用

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姓名

李睿中(Rui-Zhong Lee) 查詢紙本館藏

畢業系所

機械工程學系

論文名稱

石墨烯與奈米石墨嵌入式熱介面材料與散熱應用
(Graphene and Nanographite Embedded Composites as Thermal Interface Materials For Heat Dissipation Applications)

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摘要(中)

本論文探討熱介面材料(Thermal Interface Materials, TIMs) 之研發及性能探討。因高功率電子元件容易產生大量熱能，故常有熱破壞及熱故障之現象，由於電子元件表面有許多細微裂縫所形成之熱阻抗(Thermal resistance)，熱介面材料(TIMs)可應用於電子元件之間以填補元件間之間隙進而提升熱傳導性能。
在這項研究中，主要分為兩部份，第一部分係製備奈米銀顆粒(Silver Nano Particles, SNPs)和單壁奈米碳管(Single Wall Carbon Nanotubes, SWCNTs)採用網印刷製程(Screen Printed)於石墨烯片基板。我們將探討其TIM材料之不同方向(In-plane & Through-plane)之導電率(Electrical conductivity)與導熱率(Thermal conductivity)性能並且實際應用於IGBT與鋁散熱鰭片之間的溫度量測。第二部分則是將石墨烯(Graphene)粉末及奈米銀(Silver)粉末混合於聚二甲基矽氧烷(Polydimethylsiloxane, PDMS)利用網印技術製造熱介面材料並研究其導熱性能。
利用有限元素模擬技術(Finite Element Method)的方法，透過模擬軟體COMSOL 5.0進行模擬，將利用疲勞模組包含建模與焊點，並探討IGBT使用壽命。另針對鋁散熱片之間距對IGBT實際操作進行模擬與實驗討論。

摘要(英)

In this thesis, the thermal interface material (Thermal Interface Materials, TIMs) discussion on the development and performance. For high power electronic components easy to produce a large amount of heat, so very hot and the thermal failure of the phenomenon, as electronic component there are many fine cracks on the surface of the formation of thermal resistance, TIMs can be applied to electronic components to fill the gap between components to enhance thermal conductivity.
In this study, the study can be divided into two parts, the first part of preparation of Silver Nano Particles (SNPs) and Single Wall Carbon Nanotubes (SWCNTs) using screen printing process on Graphene substrate Board. We will explore the TIM of materials in different directions (In-plane and Through-plane) of electrical conductivity and thermal conductivity and applied to IGBT temperature measurement with aluminium cooling fins. Second part of Graphene powder and Silver Nano Particles mixed with Polydimethylsiloxane (PDMS) using screen printing technology to create thermal interface material and its thermal conductivity.

關鍵字(中)

★ 熱介面材料
★ 網印技術
★ 熱管理

關鍵字(英)

★ TIM
★ Screen Printing
★ Thermal management

論文目次

目錄
摘要 I
Abstract II
致謝 III
目錄 IV
圖目錄 VI
第一章緒論 1
1-1 前言 1
1-2 研究動機與目的 2
1-3 論文架構 3
第二章石墨片製成熱介面材料 4
2-1 奈米材料基於石墨片製成熱介面材料之應用 4
第三章網印奈米材料於石墨片散熱應用 7
3-1 網印奈米材料於石墨片之製備 7
3-2 熱導率量測 11
3-3 實際應用於溫度量測 15
3-4 SEM及元素分析 16
第四章聚二甲基矽氧烷熱介面材料 19
4-1 聚二甲基矽氧烷(PDMS)熱介面材料之製備 19
4-2 熱導率量測 21
4-3 實際應用於溫度量測 23
4-4 電子顯微鏡拍攝 26
第五章結論 27
第六章 IGBT內部接腳之熱應力與熱疲勞模擬…………………………………...28
6-1 研究方法……………………………………………………………….28
6-2 15kW IGBT內部溫度模擬架構………………………………………31
6-3 15kW IGBT內部溫度模擬流程……………………………………….32
6-4 15 kW Converter System模擬與疲勞模組介紹………………………35
6-5 模擬結果……………………………………………………………….36
參考文獻…………………………………………………………………………….40

參考文獻

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指導教授

傅尹坤

審核日期

2016-7-6

推文