參考文獻 |
[1] I. E. Agency. "Explore energy data by category, indicator, country or region," https://www.iea.org/data-and-statistics?country=WORLD&fuel=Energy%20supply&indicator=Electricity%20generation%20by%20source.
[2] B. S. R. o. W. Energy. "Years of fossil fuel reserves left," http://www.bp.com/content/dam/bp/pdf/energy-economics/statistical-review-2016/bp-statistical-review-of-world-energy-2016-full-report.pdf.
[3] C. Forman, I. K. Muritala, R. Pardemann, and B. Meyer, “Estimating the global waste heat potential,” Renewable and Sustainable Energy Reviews, vol. 57, pp. 1568-1579, 2016.
[4] S. B. Riffat, and X. Ma, “Thermoelectrics: a review of present and potential applications,” Applied Thermal Engineering, vol. 23, no. 8, pp. 913-935, 2003.
[5] X. F. Zheng, Y. Y. Yan, and K. Simpson, “A potential candidate for the sustainable and reliable domestic energy generation–Thermoelectric cogeneration system,” Applied Thermal Engineering, vol. 53, no. 2, pp. 305-311, 2013.
[6] Q. H. Zhang, X. Y. Huang, S. Q. Bai, X. Shi, C. Uher, and L. D. Chen, “Thermoelectric Devices for Power Generation: Recent Progress and Future Challenges ” Advanced Engineering Materials, vol. 18, no. 2, pp. 194-213, 2016.
[7] T. M. Tritt, “Thermoelectric materials: Principles, structure, properties, and applications,” 2002.
[8] G. J. Snyder, and E. S. Toberer, "Complex thermoelectric materials," materials for sustainable energy: a collection of peer-reviewed research and review articles from Nature Publishing Group, pp. 101-110: World Scientific, 2011.
[9] B. Sales, “Thermoelectric devices: refrigeration and power generations with no moving parts,” pp. 9179-9185, 2001.
[10] J. Li, B. Ma, R. Wang, and L. Han, “Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs,” Microelectronics Reliability, vol. 51, no. 12, pp. 2210-2215, 2011.
[11] G. Min, and D. Rowe, “Experimental evaluation of prototype thermoelectric domestic-refrigerators,” Applied Energy, vol. 83, no. 2, pp. 133-152, 2006.
[12] J. Vián, D. Astrain, and M. Domınguez, “Numerical modelling and a design of a thermoelectric dehumidifier,” Applied Thermal Engineering, vol. 22, no. 4, pp. 407-422, 2002.
[13] J. Yang, and T. Caillat, “Thermoelectric materials for space and automotive power generation,” MRS bulletin, vol. 31, no. 3, pp. 224-229, 2006.
[14] K. Sasaki, D. Horikawa, and K. Goto, “Consideration of Thermoelectric Power Generation by Using Hot Spring Thermal Energy or Industrial Waste Heat,” Journal of Electronic Materials, vol. 44, no. 1, pp. 391-398, 2014.
[15] X. Liu, Y. D. Deng, Z. Li, and C. Q. Su, “Performance analysis of a waste heat recovery thermoelectric generation system for automotive application,” Energy Conversion and Management, vol. 90, pp. 121-127, 2015.
[16] J. Xiao, T. Yang, P. Li, P. Zhai, and Q. Zhang, “Thermal design and management for performance optimization of solar thermoelectric generator,” Applied Energy, vol. 93, pp. 33-38, 2012.
[17] R. Amatya, and R. Ram, “Solar thermoelectric generator for micropower applications,” Journal of electronic materials, vol. 39, no. 9, pp. 1735-1740, 2010.
[18] M. Hyland, H. Hunter, J. Liu, E. Veety, and D. Vashaee, “Wearable thermoelectric generators for human body heat harvesting,” Applied Energy, vol. 182, pp. 518-524, 2016.
[19] R. Abelson, "Thermoelectrics Handbook: Macro to Nano, CRC," Taylor & Francis, Boca Raton, FL, USA, 2006.
[20] R. Fritts, “Thermoelectric materials and devices,” N.-Y.: Reinhold Publ. Co, 1960.
[21] Y. Pei, A. LaLonde, S. Iwanaga, and G. J. Snyder, “High thermoelectric figure of merit in heavy hole dominated PbTe,” Energy & Environmental Science, vol. 4, no. 6, pp. 2085-2089, 2011.
[22] K. Narasimhan, “THERMO-ELECTRIC PROPERTIES OF BI 2 TE 3-PBTE ALLOYS,” INDIAN J PURE APPL PHYS 8 JULY 1967, K,--7--, 261-265, 1967.
[23] C. Champness, P. Chiang, K. Grabowski, and W. Muir, “Influence of growth conditions and tellurium phase on the thermoelectric properties of bismuth telluride‐type materials,” Journal of Applied Physics, vol. 39, no. 9, pp. 4177-4183, 1968.
[24] M. Dresselhaus, G. Chen, Z. Ren, G. Dresselhaus, A. Henry, and J.-P. Fleurial, “New composite thermoelectric materials for energy harvesting applications,” Jom, vol. 61, no. 4, pp. 86-90, 2009.
[25] J. R. Szczech, J. M. Higgins, and S. Jin, “Enhancement of the thermoelectric properties in nanoscale and nanostructured materials,” Journal of Materials Chemistry, vol. 21, no. 12, pp. 4037-4055, 2011.
[26] J. P. Heremans, V. Jovovic, E. S. Toberer, A. Saramat, K. Kurosaki, A. Charoenphakdee, S. Yamanaka, and G. J. Snyder, “Enhancement of thermoelectric efficiency in PbTe by distortion of the electronic density of states,” Science, vol. 321, no. 5888, pp. 554-557, 2008.
[27] W. Scanlon, "Polar semiconductors," Solid State Physics, pp. 83-137: Elsevier, 1959.
[28] A. D. LaLonde, Y. Pei, and G. J. Snyder, “Reevaluation of PbTe1−xIx as high performance n-type thermoelectric material,” Energy & Environmental Science, vol. 4, no. 6, 2011.
[29] K. Biswas, J. He, I. D. Blum, C.-I. Wu, T. P. Hogan, D. N. Seidman, V. P. Dravid, and M. G. Kanatzidis, “High-performance bulk thermoelectrics with all-scale hierarchical architectures,” Nature, vol. 489, no. 7416, pp. 414-418, 2012.
[30] B. Paul, P. Rawat, and P. Banerji, “Dramatic enhancement of thermoelectric power factor in PbTe: Cr co-doped with iodine,” Applied Physics Letters, vol. 98, no. 26, pp. 262101, 2011.
[31] Y. Pei, X. Shi, A. LaLonde, H. Wang, L. Chen, and G. J. Snyder, “Convergence of electronic bands for high performance bulk thermoelectrics,” Nature, vol. 473, no. 7345, pp. 66-69, 2011.
[32] A. D. LaLonde, Y. Pei, H. Wang, and G. J. Snyder, “Lead telluride alloy thermoelectrics,” Materials today, vol. 14, no. 11, pp. 526-532, 2011.
[33] C.-N. Liao, and C.-H. Lee, “Suppression of vigorous liquid Sn/Te reactions by Sn–Cu solder alloys,” Journal of Materials Research, vol. 23, no. 12, pp. 3303-3308, 2008.
[34] C.-H. Lee, W.-T. Chen, and C.-N. Liao, “Effect of antimony on vigorous interfacial reaction of Sn–Sb/Te couples,” Journal of alloys and compounds, vol. 509, no. 16, pp. 5142-5146, 2011.
[35] C.-n. Chiu, C.-h. Wang, and S.-w. Chen, “Interfacial reactions in the Sn-Bi/Te couples,” Journal of electronic materials, vol. 37, no. 1, pp. 40-44, 2008.
[36] 周雅文. "火花電漿燒結技術於熱電材料開發之應用," 287; https://www.materialsnet.com.tw/DocView.aspx?id=8987.
[37] T. Sui, J. F. Li, and S. Z. Jin, "Joining CoSb3 to Metal Surface of FGM Electrode for Thermoelectric Modules by SPS." pp. 1858-1861.
[38] J. Fan, L. Chen, S. Bai, and X. Shi, “Joining of Mo to CoSb3 by spark plasma sintering by inserting a Ti interlayer,” Materials Letters, vol. 58, no. 30, pp. 3876-3878, 2004.
[39] Z. Munir, U. Anselmi-Tamburini, and M. Ohyanagi, “The effect of electric field and pressure on the synthesis and consolidation of materials: A review of the spark plasma sintering method,” Journal of materials science, vol. 41, no. 3, pp. 763-777, 2006.
[40] X. R. Ferreres, S. A. Yamini, M. Nancarrow, and C. Zhang, “One-step bonding of Ni electrode to n-type PbTe—A step towards fabrication of thermoelectric generators,” Materials & Design, vol. 107, pp. 90-97, 2016.
[41] T.-H. Chuang, W.-T. Yeh, C.-H. Chuang, and J.-D. Hwang, “Improvement of bonding strength of a (Pb, Sn) Te–Cu contact manufactured in a low temperature SLID-bonding process,” Journal of alloys and compounds, vol. 613, pp. 46-54, 2014.
[42] T. Chuang, H. Lin, C. Chuang, W. Yeh, J. Hwang, and H. Chu, “Solid liquid interdiffusion bonding of (Pb, Sn) Te thermoelectric modules with Cu electrodes using a thin-film Sn interlayer,” Journal of electronic materials, vol. 43, no. 12, pp. 4610-4618, 2014.
[43] H. Xia, F. Drymiotis, C.-L. Chen, A. Wu, and G. J. Snyder, “Bonding and interfacial reaction between Ni foil and n-type PbTe thermoelectric materials for thermoelectric module applications,” Journal of materials science, vol. 49, no. 4, pp. 1716-1723, 2014.
[44] H. Xia, F. Drymiotis, C.-L. Chen, A. Wu, Y.-Y. Chen, and G. J. Snyder, “Bonding and high-temperature reliability of NiFeMo alloy/n-type PbTe joints for thermoelectric module applications,” Journal of materials science, vol. 50, no. 7, pp. 2700-2708, 2015.
[45] H. Xia, C.-L. Chen, F. Drymiotis, A. Wu, Y.-Y. Chen, and G. J. Snyder, “Interfacial reaction between Nb foil and n-type PbTe thermoelectric materials during thermoelectric contact fabrication,” Journal of electronic materials, vol. 43, no. 11, pp. 4064-4069, 2014.
[46] C. Li, F. Drymiotis, L. Liao, H. Hung, J. Ke, C. Liu, C. Kao, and G. J. Snyder, “Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials,” Journal of Materials Chemistry C, vol. 3, no. 40, pp. 10590-10596, 2015.
[47] D. Ben-Ayoun, Y. Sadia, and Y. Gelbstein, “Compatibility between Co-Metallized PbTe Thermoelectric Legs and an Ag-Cu-In Brazing Alloy,” Materials (Basel), vol. 11, no. 1, Jan 10, 2018.
[48] S.-W. Chen, J.-C. Wang, and L.-C. Chen, “Interfacial reactions at the joints of PbTe thermoelectric modules using Ag-Ge braze,” Intermetallics, vol. 83, pp. 55-63, 2017.
[49] X. Hu, P. Jood, M. Ohta, M. Kunii, K. Nagase, H. Nishiate, M. G. Kanatzidis, and A. Yamamoto, “Power generation from nanostructured PbTe-based thermoelectrics: comprehensive development from materials to modules,” Energy & Environmental Science, vol. 9, no. 2, pp. 517-529, 2016.
[50] W.-C. Lin, Y.-S. Li, and A. T. Wu, “Study of diffusion barrier for solder/n-type Bi 2 Te 3 and bonding strength for p-and n-type thermoelectric modules,” Journal of Electronic Materials, vol. 47, no. 1, pp. 148-154, 2018.
[51] L.-C. Lo, and A. T. Wu, “Interfacial reactions between diffusion barriers and thermoelectric materials under current stressing,” Journal of electronic materials, vol. 41, no. 12, pp. 3325-3330, 2012.
[52] W. P. Lin, D. E. Wesolowski, and C. C. Lee, “Barrier/bonding layers on bismuth telluride (Bi 2 Te 3) for high temperature thermoelectric modules,” Journal of Materials Science: Materials in Electronics, vol. 22, no. 9, pp. 1313-1320, 2011.
[53] O. Iyore, T. Lee, R. Gupta, J. White, H. Alshareef, M. Kim, and B. Gnade, “Interface characterization of nickel contacts to bulk bismuth tellurium selenide,” Surface and Interface Analysis: An International Journal devoted to the development and application of techniques for the analysis of surfaces, interfaces and thin films, vol. 41, no. 5, pp. 440-444, 2009.
[54] R. Gupta, O. Iyore, K. Xiong, J. White, K. Cho, H. N. Alshareef, and B. Gnade, “Interface characterization of cobalt contacts on bismuth selenium telluride for thermoelectric devices,” Electrochemical and Solid-State Letters, vol. 12, no. 10, pp. H395-H397, 2009.
[55] C.-Y. Ko, and A. T. Wu, “Evaluation of diffusion barrier between pure Sn and Te,” Journal of electronic materials, vol. 41, no. 12, pp. 3320-3324, 2012.
[56] J.-S. Kang, Y.-S. Lee, and J.-H. Lee, “Effects of Bath Composition and P Contents on the Defects of NiP Layer in Electroless Nickel Immersion Gold Process,” Journal of nanoscience and nanotechnology, vol. 19, no. 7, pp. 4287-4291, 2019.
[57] G. Milad, and R. Mayes, “Electroless nickel/immersion gold finishes for application to surface mount technology: A regenerative approach,” Metal finishing, vol. 96, no. 1, pp. 42-46, 1998.
[58] P. Sahoo, and S. K. Das, “Tribology of electroless nickel coatings–a review,” Materials & Design, vol. 32, no. 4, pp. 1760-1775, 2011.
[59] N. M. Martyak, “Characterization of thin electroless nickel coatings,” Chemistry of materials, vol. 6, no. 10, pp. 1667-1674, 1994.
[60] M. Erming, L. Shoufu, and L. Pengxing, “A transmission electron microscopy study on the crystallization of amorphous Ni-P electroless deposited coatings,” Thin Solid Films, vol. 166, pp. 273-280, 1988.
[61] P. S. Kumar, and P. K. Nair, “Studies on crystallization of electroless Ni P deposits,” Journal of Materials Processing Technology, vol. 56, no. 1-4, pp. 511-520, 1996.
[62] H. Nakano, T. Itabashi, and H. Akahoshi, “Electroless deposited cobalt-tungsten-boron capping barrier metal on damascene copper interconnection,” Journal of The Electrochemical Society, vol. 152, no. 3, pp. C163-C166, 2005.
[63] S. Chang, C. Wan, Y. Wang, C. Shih, M. Tsai, S. Shue, C. Yu, and M. Liang, “Characterization of Pd-free electroless Co-based cap selectively deposited on Cu surface via borane-based reducing agent,” Thin Solid Films, vol. 515, no. 3, pp. 1107-1111, 2006.
[64] S. H. Bae, J. Y. Choi, and I. Son, "Effect of Electroless Ni-P Plating on the Bonding Strength of PbTe Thermoelectric Module Using Silver Alloy-Based Brazing." pp. 16-22.
[65] D. R. Lide, CRC handbook of chemistry and physics: CRC press, 2004.
[66] T. Lin, C. Liao, and A. T. Wu, “Evaluation of diffusion barrier between lead-free solder systems and thermoelectric materials,” Journal of electronic materials, vol. 41, no. 1, pp. 153-158, 2012.
[67] A. Vaskelis, A. Jagminiene, R. Juškénas, E. Matulionis, and E. Norkus, “Structure of electroless silver coatings obtained using cobalt (II) as reducing agent,” Surface and Coatings Technology, vol. 82, no. 1-2, pp. 165-168, 1996.
[68] E. Norkus, A. Vaškelis, A. Jagminienė, and L. Tamašauskaitė-Tamašiūnaitė, “Kinetics of electroless silver deposition using cobalt (II)-ammonia complex compounds as reducing agents,” Journal of applied electrochemistry, vol. 31, no. 9, pp. 1061-1066, 2001.
[69] H.-C. Hsieh, C.-H. Wang, T.-W. Lan, T.-H. Lee, Y.-Y. Chen, H.-S. Chu, and A. T. Wu, “Joint properties enhancement for PbTe thermoelectric materials by addition of diffusion barrier,” Materials Chemistry and Physics, pp. 122848, 2020.
[70] C. C. Li, F. Drymiotis, L. L. Liao, M. J. Dai, C. K. Liu, C. L. Chen, Y. Y. Chen, C. R. Kao, and G. J. Snyder, “Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing,” Energy Conversion and Management, vol. 98, pp. 134-137, 2015.
[71] J. E. Ni, E. D. Case, R. D. Schmidt, C.-I. Wu, T. P. Hogan, R. M. Trejo, M. J. Kirkham, E. Lara-Curzio, and M. G. Kanatzidis, “The thermal expansion coefficient as a key design parameter for thermoelectric materials and its relationship to processing-dependent bloating,” Journal of materials science, vol. 48, no. 18, pp. 6233-6244, 2013.
[72] Y. Hikage, S. Masutani, T. Sato, S. Yoneda, Y. Ohno, Y. Isoda, Y. Imai, and Y. Shinohara, "Thermal expansion properties of thermoelectric generating device component." pp. 331-335.
[73] Y. Pei, A. F. May, and G. J. Snyder, “Self‐Tuning the Carrier Concentration of PbTe/Ag2Te Composites with Excess Ag for High Thermoelectric Performance,” Advanced Energy Materials, vol. 1, no. 2, pp. 291-296, 2011.
[74] Y. Pei, J. Lensch‐Falk, E. S. Toberer, D. L. Medlin, and G. J. Snyder, “High thermoelectric performance in PbTe due to large nanoscale Ag2Te precipitates and La doping,” Advanced Functional Materials, vol. 21, no. 2, pp. 241-249, 2011.
[75] Y. Pei, N. A. Heinz, A. LaLonde, and G. J. Snyder, “Combination of large nanostructures and complex band structure for high performance thermoelectric lead telluride,” Energy & Environmental Science, vol. 4, no. 9, pp. 3640-3645, 2011. |