氮化鎵蕭特基二極體與高電子遷移率電晶體之設計與製作

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陳智偉(Chih-Wei Chen) 查詢紙本館藏

畢業系所

電機工程學系

論文名稱

氮化鎵蕭特基二極體與高電子遷移率電晶體之設計與製作
(Design and Fabrication of GaN Schottky Barrier Diodes and High Electron Mobility Transistors)

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摘要(中)

本論文探討製作於氮化鎵基板以及矽基板之氮化鎵功率元件，根據不同之基板類型，分成以下兩個部分討論: (1)整合垂直式的蕭特基二極體與水平式的高電子遷移率電晶體於氮化鎵基板之研究；(2)具挖洞式歐姆接觸的高電子遷移率電晶體於矽基板之研究。本研究包含元件的設計、TCAD模擬、製作與電性分析。
對於氮化鎵基板之功率元件，藉由氮離子佈植形成電流阻擋層，製作具有圓形和環形通道的垂直式氮化鎵蕭特基二極體，佈植能量及劑量分別為150/100 keV與1 × 10^15 cm^-2；電流阻擋層能夠將通道與高臺(mesa)邊緣分離，減少蝕刻損傷造成的影響以及反向偏壓下的邊緣效應，從而降低元件的漏電流並且提高崩潰電壓。此外，環形通道可以形成電流擴散，因此相較於具有圓形通道之蕭特基二極體，具有環形通道之蕭特基二極體的導通電阻會比較小，其崩潰電壓以及導通電阻分別為956 V與1.13 mΩ∙cm^2，巴利加優值（Baliga figure of merit, BFOM）為808.79 MW/cm^2。另外，水平式的氮化鎵/氮化鋁鎵高電子遷移率電晶體也可以與垂直式GaN蕭特基二極體一起同時完成，達成單片整合之設計。氮化鎵/氮化鋁鎵高電子遷移率電晶體的導通電阻與飽和電流分別為8.5 Ω‧mm (在VGS = 0 V，VDS = 0.2 V的條件下)與588.4 mA/mm (在VGS = 2 V，VDS = 10 V的條件下)。
對於矽基板之功率元件，藉由在歐姆接觸區域進行不同圖形與不同深度的挖洞，製作具有挖洞式歐姆接觸的氮化鎵/氮化鋁鎵高電子遷移率電晶體。在挖洞深度以及挖洞圖形為5.5 nm與1/3/5 μm的條件下，其特徵接觸電阻為7.1 × 10-7 Ω∙cm^2，大約比傳統無挖洞之歐姆接觸低一個數量級；並以此條件製作具挖洞式歐姆接觸之高電子遷移率電晶體，其導通電阻為14.6 Ω‧mm (在VGS = 0 V，VDS = 0.2 V的條件下)，比傳統HEMT小了約11%。

摘要(英)

In this study, the GaN power devices fabricated on GaN substrates and silicon substrates are discussed. According to different substrate types, it is divided into the following two parts for discussion: (1) Integrating vertical Schottky diodes (SBDs) and lateral AlGaN/GaN high-electron-mobility transistors (HEMTs) on GaN substrates; (2) HEMTs with recessed ohmic contacts on silicon substrates.
For the devices on GaN substrates, vertical SBDs using nitrogen ion implantation to form the circle and donut channels are proposed. Nitrogen ion with a energy of 100/150 keV and dose of 1 × 10^15 cm^-2 is used to form a current blocking layer to separate the channel from the mesa edge to reduce the etching damage and edge effect under reverse bias. The leakage current is reduced in the SBD with the donut channel thus improve the breakdown voltage. The specific differential ON-resistance (diff. RON, sp) is also improved in the SBD with a donut channel due to the wider current spreading than that in the SBD with a circle channel. A GaN SBD with the 2 μm donut channel and floating metal ring shows the diff. RON,sp of 1.13 mΩ∙cm^2 and the breakdown voltage of 956 V, with the Baliga’s Figure-Of-Merit (BFOM) of 808.79 MW/cm^2. In addition, AlGaN/GaN HEMTs can be fabricated simultaneously with vertical GaN SBDs to achieve monolithic integration. The on-resistance and saturation current of AlGaN/GaN HEMTs are 8.5 Ω‧mm (at VGS = 0 V, VDS = 0.2 V) and 588.4 mA/mm (at VGS = 2 V, VDS = 10 V) respectively.
For the devices on silicon substrates, AlGaN/GaN HEMTs with various recessed depths and recessed patterns in the ohmic region are investigated. As the recessed depth and recessed pattern is 5.5 nm and 1/3/5 μm, the specific contact resistivity of 7.1 × 10-7 Ω∙cm^2 is achieved, which is about an order of magnitude lower than that of traditional fabrication strategy without recessed. The recessed ohmic contact HEMT (ROC HEMT) exhibits the on-resistance of 14.6 Ω‧mm (at VGS = 0 V and VDS = 0.2 V), which is 11 % lower than that of the conventional HEMT.

關鍵字(中)

★ 氮化鎵
★ 功率元件
★ 高電子遷移率電晶體
★ 垂直式蕭特基二極體
★ 單片整合
★ 歐姆接觸

關鍵字(英)

★ GaN
★ power device
★ High Electron Mobility Transistors
★ Vertical Schottky Barrier Diodes
★ monolithic integration
★ Ohmic contact

論文目次

摘要......i
Abstract........ii
致謝......iii
目錄......iv
圖目錄....vii
表目錄....xiii
第一章緒論......1
1.1 前言........1
1.2 AlGaN/GaN異質結構.....3
1.3 AlGaN/GaN HEMTs與SBDs之單片整合技術發展概況.....5
1.4 GaN SBDs發展概況......7
1.4.1 水平式GaN SBDs......9
1.4.2 垂直式GaN SBDs......10
1.5 AlGaN/GaN HEMTs發展概況.......16
1.5.1 再生長式歐姆接觸.....18
1.5.2 挖洞式歐姆接觸.......20
1.6 研究動機與目的.........23
1.7 論文架構......24
第二章 HEMT結構磊晶層於GaN基板及矽基板之磊晶結構與材料分析.....25
2.1 前言.........25
2.2 HEMT結構磊晶層於GaN基板之磊晶結構.......25
2.3 HEMT結構磊晶層於矽基板之磊晶結構........26
2.4 HEMT結構磊晶層於GaN基板與矽基板之材料分析........28
2.4.1 傳輸線模型量測.......28
2.4.2 霍爾量測....29
2.4.3 原子力顯微鏡量測.....30
2.4.4 蝕刻孔洞密度量測.....31
2.4.5 X-光繞射儀量測......32
2.4.6 垂直崩潰電壓量測.....34
2.4.7 水平崩潰電壓量測.....36
2.5 本章總結......39
第三章單片整合垂直式SBDs與AlGaN/GaN HEMTs於GaN基板.........40
3.1 前言.........40
3.2 元件佈局設計..40
3.2.1 AlGaN/GaN垂直式SBDs之佈局設計........41
3.2.2 AlGaN/GaN HEMTs之佈局設計...43
3.3 垂直式SBDs與AlGaN/GaN HEMTs之製作流程..44
3.4 元件電性模擬結果.......47
3.5 電容-電壓特性之量測結果........52
3.6 常溫之電性量測結果.....54
3.6.1 垂直式GaN SBDs之電性分析.....54
3.6.2 AlGaN/GaN HEMTs之電性分析...65
3.7 變溫之電性量測結果.....68
3.7.1 順向導通特性分析.....68
3.7.2 反向漏電流特性分析...74
3.8 本章總結......78
第四章具挖洞式歐姆接觸之AlGaN/GaN HEMTs....79
4.1 前言.........79
4.2 元件佈局設計..79
4.2.1 挖洞式歐姆接觸之佈局設計......80
4.2.2 AlGaN/GaN HEMTs之佈局設計...82
4.3 AlGaN/GaN HEMTs製作流程.......83
4.4 元件電性模擬結果.......86
4.5 元件電性量測結果.......90
4.5.1 歐姆接觸電阻分析.....91
4.5.2 直流特性分析........92
4.5.3 動態特性分析........99
4.6 本章總結......105
第五章結論.......107
參考文獻.........108
附錄 Ⅰ 製作於GaN基板之垂直式SBDs與AlGaN/GaN HEMTs的製作流程..117
附錄 Ⅱ 製作於矽基板之AlGaN/GaN HEMTs的製作流程..............120

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指導教授

辛裕明(Yue-Ming Hsin)

審核日期

2020-8-20

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