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姓名	詹宗昊(Tsung-Hao Chan)  查詢紙本館藏	畢業系所	光機電工程研究所
論文名稱	銅/氧化鋅網格透明電極之雷射直寫製作及其特性分析 (Fabrication and Characteristization of Laser-direct-written Copper/Zinc Oxide Mesh Transparent Electrode)
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摘要(中)	銦錫氧化物(ITO)擁有很好的導電性和透光度，因材料稀有與缺乏機械性質無法用於柔性基板等缺點，最近幾年來，許多研究積極尋找銦錫氧化物(ITO)的替代材料，金屬材料金、銀和銅可以用於製作可撓性透明電極其透光度與導電性表現非常優異，但由於金與銀稀少而成本昂貴；銅表面易氧化形成氧化銅而失去電性，目標為尋找一種成本降低且抗氧化的電極。 本研究首要目標是使用雷射直寫製作可撓性且可抗氧化金屬網格透明電極，將基板從玻璃基板換成PI基板以檢測可撓性，並於高溫的環境下以不同銅與氧化鋅比例的電極檢測其導電性。甲酸銅與乙酸鋅透過加熱可分別還原形成銅與氧化鋅，本研究以不同比例的甲酸銅與乙酸鋅溶於溶劑中，置備出有機金屬墨水旋塗於玻璃基板與可撓性基板上形成均勻薄膜並於加熱板上去除多餘溶劑，以波長532 nm連續式雷射進行50倍的聚焦將甲酸銅與乙酸鋅進行熱分解與燒結，並配合移動平台製成金屬網格達成圖案化，最後製作的金屬網格其線寬為12μm，平均厚度為650nm，透光度達88 %其電阻率最好可以達到 21×〖10〗^(-8) Ωm為銅材的13倍。由於在高溫的環境下銅更容易氧化而失去電性。 本研究將純銅金屬網格與不同比例的銅與氧化鋅於160°C加熱板上，放置24小時檢測電阻值變化，經過12小時純銅金屬網格增加106倍，而銅與氧化鋅比例為4:1時放置24小時僅增加25倍。接著檢測機械性，將金屬網格燒結於PI柔性基板上，以曲率半徑為5mm彎曲5000次，其電阻率為30×〖10〗^(-8) Ωm電阻變化為43％。
摘要(英)	Indiμm tin oxide (ITO) has good conductivity and transmittance, but it is brittle that cannot be used for flexible substrates.In recent years, many studies have searched for alternative materials for indium tin oxide (ITO). The metallic materials,such as gold, silver, and copper can be used to make flexible transparent electrodes. Their transparency and electrical conductivity are excellent, due to gold and silver are more expensive, but copper is easy to get oxidized form copper oxide on the surface and lose electrical properties. Therefore,this research is to find an electrode with reduced cost and oxidation resistance. This research’s primary goal is to use laser direct writing to make flexible and oxidation-resistant metal mesh transparent electrodes. Changing the substrate from a glass substrate to a PI substrate to detect flexibility, at the environment of high temperature, electrodes with different ratios of copper and zinc oxide to detect their conductivity. Copper formate and zinc acetate can be respectively reduced to copper and zinc oxide by heating. In this study, different ratios of copper formate and zinc acetate were dissolved in the solvent, and organometallic ink was prepared by spin coating on the glass substrate to form a uniform film and on the heating plate remove the excess solvent, focus 50 times with a continuous laser at a wavelength of 532 nm, thermally decompose and sinter copper formate and zinc acetate, and make a metal mesh with a mobile platform to achieve patterning, Finally, makeing the metal grid with its lines the width is 15μm, the average thickness is 650nm, the transmittance is 88%, and the resistivity can best reach 21×〖10〗^(-8) Ωm which is copper’s 13 times. In the literature, copper is more likely to oxidize and lose electricity in high-temperature environments. In this study, pure copper metal grids and different proportions of copper and zinc oxide were placed on a 160°C heating plate and placed for 24 hours to detect resistance changes. The pure copper metal grid increases 106 times after 12 hours, the ratio of copper to zinc oxide is 4:1, and it only increases 25 times when placed for 24 hours. After that mechanical were detected, the metal grid was sintered on the PI flexible substrate, and the bending radius was 5 mm. The bending was 5000 times, and the resistivity was 30×〖10〗^(-8) Ωm. The resistance change was 43%.
關鍵字(中)	★ 雷射直寫技術 ★ 抗氧化金屬網格 ★ 可撓性透明電極	關鍵字(英)	★ laser direct writing ★ anti-oxidation metal mesh ★ flexible transparent electrode
論文目次	目錄 Chapter 1 緒論________________________________________ 1 1-1 前言_____________________________________________1 1-2 研究背景__________________________________________2 Chapter 2 文獻回顧 ____________________________________4 2-1 金屬電極__________________________________________4 2-1-1 金屬奈米線____________________________________4 2-1-2 噴墨製程_______________________________________7 2-1-3 化學鍍金屬沉積______________________________8 2-1-4 氙燈燒結_______________________________________9 2-1-5 光刻__________________________________________11 2-1-6 雷射直寫______________________________________12 2-1-7 金屬電極不同製程之比較____________________14 2-2 金屬墨水_________________________________________15 2-3 高抗氧化銅電極 ________________________________17 2-3-1 金屬核殼結構 ________________________________17 2-3-2 二元合金______________________________________19 2-3-3 石墨烯包覆 ___________________________________20 2-3-4 氧化物包覆 ___________________________________22 2-4 溶膠凝膠法 製成 氧 化鋅 薄 膜應 用 ______________25 2-5 傳承與創新______________________________________29 Chapter 3 實 驗方 法 ___________________________________30 3-1 實 驗流 程_________________________________________30 3-2 實 驗步 驟_________________________________________30 3-2-1 基板處理_______________________________________30 3-2-2 甲 酸 銅 與乙 酸 鋅配 置 有機 金屬 墨 水 __________30 3-2-3 薄膜製備_______________________________________30 3-2-4 雷 射 直 寫誘 發 熱分 解_________________________32 3-2-5 PI 基 板 利於 撓 曲實 驗 ________________________32 3-3 實 驗用 品_________________________________________32 3-3-1 實驗藥品_______________________________________ 32 3-3-2 實 驗 儀 器設 備 ________________________________33 3-3-3 波 長 532 nm 連 續式 雷 射規 格 _________________34 3-4 材 料分 析 儀 器 __________________________________34 3-4-1 熱 重 分 析儀 (Thermogravimetric analysis，TGA___34 3-4-2 單 晶 X 光繞 射 儀(Single-Crystal X-ray Diffraction，XRD)____________________________________ 34 3-4-3 場 發 掃 描式 電 子顯 微 鏡 (Field-emmision Scanning Electronic Microscopy， FESEM)________________________35 Chapter 4 結 果與 討 論________________________________36 4-1 材 料分 析________________________________________36 4-1-1 乙酸鋅/異丙 醇/異丙醇 胺 有機 金 屬墨 水__________37 4-1-2 甲酸銅/乙酸鋅/異丙醇/異丙醇胺有機金屬墨水 _________38 4-1-3 熱 重 分 析判 斷 雷射 直 寫結 果 _________________39 4-2 表 面形 貌 與 成份 分 析 __________________________40 4-2-1 甲酸 銅 與乙 酸鋅 的 比例 為 1:1 之表 面 形貌 與 EDS 分析______________________________________________40 4-2-2 甲酸 銅 與乙 酸鋅 的 比例 為 2:1 之表 面 形貌 與 EDS 分析_________________________________________42 4-2-2 甲酸 銅 與乙 酸鋅的 比例 為 4:1 之表 面 形貌 與 EDS 分析______________________________________________43 4-2-4 甲酸 銅 之表 面形 貌 與 EDS 分析 ______________________________________46 4-2-5 不同 雷 射功 率與 平 台走 速 下網 格表 面 形貌 及 EDS 分析 _____________________________________________________47 4-2-6 小結 ___________________________________________50 4-3 XRD 分 析________________________________________52 4-4 導 電性 _________________________________55 4-5 透 光度 測 試_________________________________56 4-6 可 撓性 測 試___________________________57 4-7 抗 氧化 測 試_____________________________________59 Chapter 5 結 論與 未 來研 究 方向_______________________61 5-1 結 論_____________________________________________61 5-2 未 來研 究 方 向 __________________________________61 參考 文 獻____________________________________________ 62
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指導教授	何正榮(Jeng-Rong Ho)	審核日期	2021-1-26
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