參考文獻 |
參考文獻
1. Nekouei, R.K., et al., Current trends in direct transformation of waste printed circuit boards (WPCBs) into value-added materials and products. Current Opinion in Green and Sustainable Chemistry, 2020. 24: p. 14-20.
2. Williams, P.T., Valorization of printed circuit boards from waste electrical and electronic equipment by pyrolysis. Waste and Biomass Valorization, 2010. 1(1): p. 107-120.
3. Gautam, P., et al., High added-value materials recovery using electronic scrap-transforming waste to valuable products. Journal of Cleaner Production, 2022. 330: p. 129836.
4. Wang, J. and Z. Xu, Disposing and recycling waste printed circuit boards: disconnecting, resource recovery, and pollution control. Environmental science & technology, 2015. 49(2): p. 721-733.
5. Hu, D., et al., High Value-Added Reutilization of Waste-Printed Circuit Boards Non-Metallic Components in Sustainable Polymer Composites. Molecules, 2023. 28(17): p. 6199.
6. Luda, M.P., Recycling of printed circuit boards, in Integrated Waste Management-Volume II. 2011, IntechOpen.
7. Oluokun, O.O. and I.O. Otunniyi, Kinetic analysis of Cu and Zn dissolution from printed circuit board physical processing dust under oxidative ammonia leaching. Hydrometallurgy, 2020. 193: p. 105320.
8. Wan, X., et al., Reaction mechanisms of waste printed circuit board recycling in copper smelting: The impurity elements. Minerals Engineering, 2021. 160: p. 106709.
9. Tang, C., et al., Electrochemical dissolution and recovery of tin from printed circuit board in methane–sulfonic acid solution. Hydrometallurgy, 2021. 205: p. 105726.
10. Kang, K.D., et al., Assessment of pre-treatment techniques for coarse printed circuit boards (PCBs) recycling. Minerals, 2021. 11(10): p. 1134.
11. Ning, C., et al., Waste printed circuit board (PCB) recycling techniques. Chemistry and Chemical Technologies in Waste Valorization, 2018: p. 21-56.
12. Peng, M., et al. New solutions for reusing nonmetals reclaimed from waste printed circuit boards. in Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. 2005. IEEE.
13. Peerzada, M., et al., Additive manufacturing of epoxy resins: materials, methods, and latest trends. Industrial & Engineering Chemistry Research, 2020. 59(14): p. 6375-6390.
14. Farahani, R.D., M. Dubé, and D. Therriault, Three‐dimensional printing of multifunctional nanocomposites: manufacturing techniques and applications. Advanced materials, 2016. 28(28): p. 5794-5821.
15. Shah, M., et al., Vat photopolymerization-based 3D printing of polymer nanocomposites: current trends and applications. RSC advances, 2023. 13(2): p. 1456-1496.
16. Gonzalez, G., et al., Development of 3D printable formulations containing CNT with enhanced electrical properties. Polymer, 2017. 109: p. 246-253.
17. Hao, W., et al., Preparation and characterization of 3D printed continuous carbon fiber reinforced thermosetting composites. Polymer Testing, 2018. 65: p. 29-34.
18. Ren, N., et al., Filler-reinforced elastomers based on functional polyolefin prepolymers. Industrial & Engineering Chemistry Research, 2016. 55(21): p. 6106-6112.
19. Watanabe, R., et al., Polypropylene-based nanocomposite with enhanced aging stability by surface grafting of Silica Nanofillers with a silane coupling agent containing an antioxidant. ACS omega, 2020. 5(21): p. 12431-12439.
20. Yu, J., et al., Silane coupling agent modification treatment to improve the properties of rubber–cement composites. ACS Sustainable Chemistry & Engineering, 2021. 9(38): p. 12899-12911.
21. Zheng, W., et al., Micro-scale effects of nano-SiO2 modification with silane coupling agents on the cellulose/nano-SiO2 interface. Nanotechnology, 2019. 30(44): p. 445701.
22. Tóth, Á.D., et al., Surface Modification of Silica Nanoparticles with Ethyl Oleate for the Purpose of Stabilizing Nanolubricants Used for Tribological Tests. Ceramics, 2023. 6(2): p. 980-993.
23. Zhang, C., et al., Nano‐sio2‐reinforced ultraviolet‐curing materials for three‐dimensional printing. Journal of Applied Polymer Science, 2015. 132(31).
24. Nakashima, Y., M. Fukushima, and H. Hyuga, Surface modification of silica powder by mild ball milling. Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2022. 652: p. 129828.
25. Yoğurtcuoğlu, E. and M. Uçurum, Surface modification of calcite by wet-stirred ball milling and its properties. Powder Technology, 2011. 214(1): p. 47-53.
26. Ning, R., et al., Surface modification of titanium hydride with epoxy resin via microwave-assisted ball milling. Applied surface science, 2014. 316: p. 632-636.
27. 張睿丰, 開發液漩式重力分選技術用於廢棄 PCB 成型板粉塵回收資源化, in 材料科學與工程研究所. 2023, 國立中央大學.
28. Muhammad, Y.H. and S. Ahmad, Mechanical and thermal properties of glass fiber-reinforced epoxy composite with matrix modification using liquid epoxidized natural rubber. Journal of Reinforced Plastics and Composites, 2013. 32(9): p. 612-618.
29. Hameed, N., et al., Morphology, dynamic mechanical and thermal studies on poly (styrene-co-acrylonitrile) modified epoxy resin/glass fibre composites. Composites Part A: Applied Science and Manufacturing, 2007. 38(12): p. 2422-2432.
30. Tarani, E., et al., Effect of ball milling time on the formation and thermal properties of Ag2Se and Cu2Se compounds. Journal of Thermal Analysis and Calorimetry, 2023. 148(23): p. 13065-13081.
31. Barman, S. and R. Chakraborty, Printed circuit board-derived glass fiber-epoxy resin-supported Mo–Cu bimetallic catalyst for glucose synthesis. ACS omega, 2018. 3(12): p. 18499-18509.
32. Barnwal, A., S. Mir, and N. Dhawan, Processing of discarded printed circuit board fines via flotation. Journal of Sustainable Metallurgy, 2020. 6: p. 631-642.
33. Das, R.K., et al., Influence of non-metallic parts of waste printed circuit boards on the properties of plasticised polyvinyl chloride recycled from the waste wire. Waste Management & Research, 2019. 37(6): p. 569-577.
34. Gao, X., Q. Li, and J. Qiu, Hydrothermal modification and recycling of nonmetallic particles from waste print circuit boards. Waste management, 2018. 74: p. 427-434.
35. Nakashima, Y., et al., Non-firing ceramics: Activation of silica powder surface for achieving high-density solidified bodies. Advanced Powder Technology, 2018. 29(8): p. 1900-1903.
36. Nakashima, Y., et al., Non-firing ceramics: effect of adsorbed water on surface activation of silica powder via ball milling treatment. Advanced Powder Technology, 2019. 30(6): p. 1160-1164.
37. Zhao, R. and W. Luo, Fracture surface analysis on nano-SiO2/epoxy composite. Materials Science and Engineering: A, 2008. 483: p. 313-315.
38. Nayak, R.K., A. Dash, and B. Ray, Effect of epoxy modifiers (Al2O3/SiO2/TiO2) on mechanical performance of epoxy/glass fiber hybrid composites. Procedia materials science, 2014. 6: p. 1359-1364. |