台灣的晶圓代工在半導體產業的產業鏈中，上下游廠商間的垂直分工是半導體產業結構上一大特色，也是建構台灣高科技產業的技術進步與專業化能力提升之成功關鍵因素。晶圓代工專注於製造中間財，並透過外包分工來完成中間財的生產。相較於韓國、日本與歐美等半導體大廠的發展與運作，以整合元件製造廠居多。張明宗（1998）指出垂直分工是以市場機制運作，進而取代組織之內部管理（有去組織化之意）。因此，垂直分工不但替代了內部管理更降低了市場的交易成本。 本研究以賽局理論探討台灣晶圓代工之垂直分工與競爭，並將晶圓代工產業之上下游廠商位置做一調整：上游是IC製造廠－晶圓代工，下游為IC設計公司。因此，在財貨上更貼近於消費者，在市場主體架構上則更為明確。 本研究結論探究台灣晶圓代工產業之面臨的兩大挑戰：成長與獲利問題。面對全球化競爭，台灣晶圓代工產業如何突破成長趨勢；面對微利時代，台灣晶圓代工產業如何創造更多的利潤。 Taiwan's IC foundry in the semiconductor industry of industrial chain, it is a characteristic on the industrial structure of the semiconductor to vertical disintegration among the IC foundry industrial from upstream to downstream, build the key factor of success that technological progress and specialized ability of constructing the Hi-Tech industry of Taiwan. The IC foundry focuses on product upstream（Intermediate）goods and finishes the downstream（final）goods by outsourcing. The development and operation than in such big factories of the semiconductor as S. Korea, Japan and America and Europe, etc., they business model are Integration Device Manufacture, IDM. Chang (1998) indicated that the vertical disintegration is with market mechanism, and then replace internal management of organization. Thus, the vertical disintegration has not only substituted the internal management and the transaction cost that has reduced the market even more. This research discussed both the vertical disintegration phenomenon and competition analysis of Taiwan by the game theory, and this research adjustment in the position: Upstream is IC manufacturer-IC foundry, downstream is IC design. Thus, the final goods and the market structure are clearly explained. This research conclusion discussed two major challenges that foundry industry of Taiwan: the company growth and the market profit issue. First, how to faced the competition for globalization, Taiwan's foundry industrial how about industry breaks through the trend of growing up. Second, in the face of meager profit era, Taiwan's IC foundry how about sets more profits.
