摘 要 本研究探討錫-9鋅-(0~4)銀銲料迴銲於化金基板上上之電化學遷移行為，將其完全浸泡於純水溶液中，兩銲球間施以3V~5V直流偏壓，結果顯示：銲料中增加銀含量與提高施加偏壓，皆會造成銲料抗電化學遷移能力下降。 在純水中之陽極動態極化研究結果顯示：本系統銲料之開路電位隨著銀含量增加而微幅上升，且陽極電流隨銲料中的銀含量增加而提高。X光光電子譜儀分析顯示：迴銲後銲錫表面有一層SnO2覆蓋。銲料中銀含量越高，導致主要引起兩極間析出物的鋅與錫兩元素，會隨遷移時間變化其比例亦隨之變化。 錫-9鋅-(0~4)銀銲錫分別在迴銲後爐冷、空冷、油冷、水冷四種情況下，其冷卻速率越快越容易產生電化學遷移行為。從迴銲後不同冷卻速率之XPS分析中發現銲球表面產生氧化層程度不同；從動態極化曲線中發現：當冷卻速率越快，陽極的反應電流越大。 Abstract Electrochemical migration behaviors of the Sn-9Zn-(0~4)Ag solders reflowed on Cu/Ni/Au substrate have been studied. The electrochemical migration resistance of the Sn-9Zn-(0~4)Ag solders at a bias of 3V~5V in pure water decreased with in creasing Ag content from 0 to 4 wt% and electrical bias from 3 to 5 V. The anode potentiodynamic polarization in pure water showed that OCP of Sn-9Zn-(0~4)Ag increased slightly with increasing Ag. The anode current of solders increased with increasing Ag content at the solder ball. From XPS spectra showed that SnO2 oxide covered on the solder balls after reflow. The ratio of Ag in the solder ball caused to migration precipitate between solder balls and the ratio of Zn and Sn changes with time. When Sn-9Zn-(0~4)Ag solder after reflow the cooling rate would increase , the electrochemical resistance will decrease in four cooling state at oven、air、oil、water cooling. From XPS analysis show that solder ball after reflow the surface produced oxide proportion is different at different cooling rate ; from the anode potentiodynamic polarization showed that cooling rate increase the anode reaction increased.
