Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder

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Title:	Effects of strain ratio and tensile hold time on low-cycle fatigue of lead-free Sn-3.5Ag-0.5Cu solder
Authors:	Lin CK,Huang CM
Contributors:	材料科學與工程研究所
Keywords:	SN-AG-CU;BEHAVIOR;JOINTS;BI;96.5SN-3.5AG;TEMPERATURE;ELECTRONICS;FAILURE;ALLOYS;MODELS
Date:	2006
Issue Date:	2010-07-06 15:59:10 (UTC+8)
Publisher:	中央大學
Abstract:	Low-cycle fatigue (LCF) behavior of a lead-free Sn-3.5Ag-0.5Cu solder alloy was investigated at various combinations of strain ratio (R = -1, 0, and 0.5) and tensile hold time (0, 10, and 100 sec). Results showed that the LCF life of the given solder, at
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[Institute of Materials Science and Engineering] journal & Dissertation

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