Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates

NCUIR > Engineering College > Institute of Materials Science and Engineering > journal & Dissertation > Item 987654321/29851

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/29851

Title:	Microstructure evolution of gold-tin eutectic solder on Cu and Ni substrates
Authors:	Tsai JY,Chang CW,Ho CE,Lin YL,Kao CR
Contributors:	材料科學與工程研究所
Keywords:	SN
Date:	2006
Issue Date:	2010-07-06 15:59:22 (UTC+8)
Publisher:	中央大學
Abstract:	The microstructures of the eutectic Au20Sn (wt.%) solder that developed on the Cu and Ni substrates were studied. The Su/Ni sandwich structure (2.5/3.75/2 mu m) and the Su/Ni sandwich structure (1.83/2.74/5.8 mu m) were deposited on Si wafers first.
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[Institute of Materials Science and Engineering] journal & Dissertation

Files in This Item:

File	Description	Size	Format
index.html		0Kb	HTML	519	View/Open

社群 sharing