Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30694

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30694

Title:	Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization
Authors:	Hsu,SC;Wang,SJ;Liu,CY
Contributors:	化學工程與材料工程研究所
Keywords:	EUTECTIC SNPB;SOLDERING REACTION;EVOLUTION;NI
Date:	2003
Issue Date:	2010-07-06 16:25:13 (UTC+8)
Publisher:	中央大學
Abstract:	The effect of Cu content in Sn(Cu) alloys on the interfacial reaction between Ni thin film and Sn(Cu) alloys has been investigated. We have found that the variation of Cu content has a strong influence on the spalling of the Ni thin film. With small Cu ad
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

Files in This Item:

File	Description	Size	Format
index.html		0Kb	HTML	438	View/Open

社群 sharing