Electromigration failure in flip chip solder joints due to rapid dissolution of copper

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30706

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30706

Title:	Electromigration failure in flip chip solder joints due to rapid dissolution of copper
Authors:	Hu,YC;Lin,YH;Kao,CR;Tu,KN
Contributors:	化學工程與材料工程研究所
Keywords:	LEAD-TIN ALLOYS;DIFFUSION;SILVER
Date:	2003
Issue Date:	2010-07-06 16:25:28 (UTC+8)
Publisher:	中央大學
Abstract:	An electromigration failure mechanism in flip chip solder joints is reported in this communication. The solder joints failed by a very rapid, asymmetrical, and localized dissolution of the Cu metallization on the cathode side. The average dissolution rate
Relation:	JOURNAL OF MATERIALS RESEARCH
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

Files in This Item:

File	Description	Size	Format
index.html		0Kb	HTML	382	View/Open

社群 sharing