Electromigration studies on Sn(Cu) alloy lines

NCUIR > Engineering College > National Central University Department of Chemical & Materials Engineering > journal & Dissertation > Item 987654321/30708

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/30708

Title:	Electromigration studies on Sn(Cu) alloy lines
Authors:	Lu,CC;Wang,SJ;Liu,CY
Contributors:	化學工程與材料工程研究所
Keywords:	EUTECTIC SNPB;CU;INTERCONNECTS;FILMS
Date:	2003
Issue Date:	2010-07-06 16:25:31 (UTC+8)
Publisher:	中央大學
Abstract:	The Cu alloying effect in the Sn(Cu) solder line has been studied. The Sn0.7Cu solder line has the most serious electromigration (EM) damage compared to pure Sn and Sn3.0Cu solder lines. The dominant factor for the fast EM rate in Sn0.7Cu could be attribu
Relation:	JOURNAL OF ELECTRONIC MATERIALS
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] journal & Dissertation

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