Interactions between solder and metallization during long-term aging of advanced microelectronic packages

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題名:	Interactions between solder and metallization during long-term aging of advanced microelectronic packages
作者:	Ho,CE;Chen,WT;Kao,CR
貢獻者:	化學工程與材料工程研究所
關鍵詞:	JOINTS;GROWTH
日期:	2001
上傳時間:	2010-07-06 16:30:23 (UTC+8)
出版者:	中央大學
摘要:	The reactions between the eutectic PbSn solder and the Au/Ni/Cu tri-layer metallization in advanced microelectronic packages were studied. In this investigation, reflowed packages were subjected to aging at 160 degreesC for times as long as 4000 h. Immedi
關聯:	JOURNAL OF ELECTRONIC MATERIALS
顯示於類別:	[化學工程與材料工程研究所] 期刊論文

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