本論文採用專利之微陽極導引電鍍法來析鍍直徑在50-100 μm範圍之銅、鎳等金屬微柱。此種金屬微柱之表面形貌、內部結構、機械性質、以及在3.5wt%NaCl 溶液中之腐蝕行為等為本研究之題材。微電鍍法乃以微陽極導引方式來規範微電柱之成長，藉由改變兩極間之偏壓與兩極間距離等析鍍參數，來探討所得微柱形貌、結構、性質等受到之影響。形貌與結構等由掃描式電子顯微鏡進行觀察比較。機械性質藉由微應力拉伸試驗機來測量，鍍銅微柱在2.8V偏壓與15μm兩極間距下製程楊氏係數可達64.6GPa，鍍鎳微柱在3.6V偏壓與15μm兩極間距下製程楊氏係數可達182.3GPa；在3.5wt%NaCl 溶液中之腐蝕行則使用交流阻抗頻譜儀來分析。使用之偏壓太高時，微柱之表面粗糙，結構之均勻性較差，機械性質變化較大，耐蝕性較差。低偏壓下所得之銅、鎳微柱，表面較細緻，結構較均勻，機械性質之變化小，在腐蝕溶液中之耐蝕性也較高，鍍銅微柱在2.8V偏壓與15μm兩極間距下製程電荷轉移阻抗為3.88×10^6 Ω，鍍鎳微柱在3.6V偏壓與15μm兩極間距下製程電荷轉移阻抗可達4.00×10^6 Ω。 Micrometer copper and nickel pillars were fabricated by localized electrochemical deposition (LECD) through a patented process of micro-anode guided electroplating (MAGE). Many pillars obtained by changing the electroplating parameters such as the electrical voltages and the separation between the electrodes were of concern to compare their surface morphology, internal structure, mechanical property and corrosion behavior in 3.5 wt% NaCl solution. The surface morphology and internal structure were inspected by scanning electron microscope. The mechanical properties were measured by using a micro stress tensile tester, the copper pillars maximum young’s modulus can reach to 64.6 GPa and the nickel pillars maximum young’s modulus can reach to182.3 Gpa. The corrosion behavior of the micro pillars in the 3.5 wt % saline solution was investigated by direct current electrochemical polarization and electrochemical impedance spectroscopy (EIS) study. The micrometer pillars attained at higher electric voltage reveal rougher surface, non-uniform internal, higher variation in mechanical property and are less corrosion resistant in the saline solution than those obtained at lower voltage. The pillars fabricated by LECD are more corrosion resistant than those fabricated by withdrawing process from metallic rods.
