此實驗的研究目的是應用在積體電路板上的防焊綠漆擁有最佳顯影能力和解析度，研究關於防焊綠漆的製程獲得最佳化條件，並比較AUS320油墨與AUS308油墨的不同，AUS 320擁有廣泛的且穩定操作條件，能到較好的解析品質和顯影能力。 研究所使用的儀器有FTIR、DSC、TGA、DMA、和SEM研究機械性質。 液態感光型防焊綠漆為無鹵素材料，我們選擇稀釋比例、預烘烤時間、曝光能量、顯影速度和後烘烤條件為控制因素，從黏性測試的結果來看，AUS 320比AUS 308擁有更好的預烘烤能力，預烘烤在38分鐘過後就沒有滾輪壓痕，生產能力比AUS308更好，AUS 320可以應用在整平上，雖然厚度高於AUS308，但仍然擁有良好的整平性能。開口能力在80 μm以上能得到高的解析度，而且孔壁側邊相當清楚沒有殘留物。利用FTIR量測交聯反應也都有高於97%的反應率。 The object of this research about solder mask in PCB is that with the good developable property and resolution, To get the best condition for each solder mask, we study about solder mask process and compared the difference between AUS 320 and AUS 308, AUS 320 has wider and stable process window and a great resolution , developable property. Study the mechanical properties by using fourier transform infrared spectroscopy, differential scanning calorimeter, thermogravimetric analyzer,dynamic mechanical analysis and scanning electron microscope. AUS320 liquid photo imageable solder mask is halogen free material,we selected the dilution ratio,precure time,expose energy ,develop velocity and postcure condition as the control factors. From the result of tack dry, the performance of AUS 320 preheat has better tack comparison than AUS 308, there will be no roller mark after preheated for 38mins. Productivity is better than AUS 308. AUS 320 can apply on SM leveling, even that hardness is higher that AUS 308, it still has good leveling performance. The opening can get high resolution above the 80 μm, and the side wall is quite clean with no debris. The curing degree is higher than 97% by measuring with FTIR.
