本文利用田口實驗設計法來規劃實驗，再藉由SN比，尋找印刷電路板無鹵素膠片壓合製成最佳化之壓合條件，以達可以快速得到所需求的品質目標。 實驗設計採用田口方法中的L9直交表，選擇壓合壓力、壓合溫度、壓合時間及升溫速率為控制因子，每一因子皆選擇三個水準，其品質目標則是拉力強度(Peeling Strength)；以玻璃轉移溫度變化量(△Tg)與熱膨脹係數(CTE)做為評估的指標並決定影響各品質最鉅的控制因子。 實驗的結果選擇壓合時間為60min、壓合溫度為190℃、壓合壓力為250psi與升溫速率為1.2℃/min，玻璃轉移溫度變化量(△Tg)為4.42℃、高溫熱膨脹係數(α2)為294.40 μm/(m．℃)與影響最鉅的控制因子為壓合溫度。 This research is to conduct the experiment by using Takuchi Methods. The Singnal to Noise Ratios is also used to figure out the optimum combination for Printed Circuit Board without halogen free prepreg lamination process, which can facilitate to reach the required quality target. This experiment adopted L9(34) orthogonal array. We selected the lamination time, lamination temperature, lamination process and heat rate as the control factors.3 degree levels have been set for each factor to each the quality target of peeling strength；delta glass transition temperature (△Tg) and coefficient of thermal expansion (CTE) are valuation target which is selected as the best effect control factor. The result experiment shows that the delta glass transition temperature (△Tg) is 4.42℃ and the high temperature coefficient of thermal (α2) is 294.40 μm/(m．℃) when selected lamination time is 60min, lamination temperature is 190℃, lamination pressure is 250psi and heat rate is 1.2℃/min. Besides, the best effect control factor is lamination temperature.
