新型熱熔膠拋光墊的研製及其對單晶矽與不銹鋼材料之拋光研究; A study on the manufacturing of new hot melt adhesive polishing pad and its effects on polishing monocrystalline silicon and stainless steel workpiece

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題名:	新型熱熔膠拋光墊的研製及其對單晶矽與不銹鋼材料之拋光研究;A study on the manufacturing of new hot melt adhesive polishing pad and its effects on polishing monocrystalline silicon and stainless steel workpiece
作者:	蔡松霖;Sung-lin Tsai
貢獻者:	機械工程研究所
關鍵詞:	磁性流體;單晶矽;表面粗糙度值;熱熔膠;拋光墊;surface roughness;silicon;Hot melt adhesive;Polishing pad;Magnetic compound fluid
日期:	2011-07-19
上傳時間:	2012-01-05 12:29:40 (UTC+8)
摘要:	拋光墊(Polishing pad)的應用是使工件達到精微表面拋光，可有效移除工件表面凹凸及平坦化的效果。拋光墊的發展可追溯至人類遠古時期對於玉、青銅器及寶石的鏡面拋光。近年隨著半導體技術發展與應用，半導體晶圓等材料表面的精密拋光亦顯重要，拋光墊的發展也日新月異。目前眾多研磨拋光的發展，通常以針對拋光條件或拋光機制進行探討居多，對於開發新式拋光墊的研究文獻甚少。本研究針對此課題，利用實際製作拋光墊與拋光實驗，深入分析探討其對工件表面形貌的影響。在實驗方面，本研究研製了新型熱熔膠拋光墊(Hot melt adhesive pad, HMA pad)並以其對單晶矽進行拋光實驗，同時亦利用磁性流體 (Magnetic compound fluid, MCF)對SUS-304 不銹鋼工件進行研磨拋光實驗。研究結果發現，自製熱熔膠拋光墊噴塗距離的控制攸關拋光墊的好壞與性質；不同披覆磨粒型態的熱熔膠拋光墊，其中以混合磨粒含量5w.t%者對於研磨單晶矽有較佳的表面粗糙度與均勻度。對於單晶矽次表面層的研究發現，損傷層約100-150 nm、非晶矽層約10 nm。由磁性流體對單晶矽表面研磨研究發現，磁性流體對改善表面形貌的效果非常顯著，表面粗糙度由初始0.25μm 降至0.031μm。而藉由配製磁性流體的研究發現，配製磁流體以矽油黏度1000 mm2/s 含量30g、羰基鐵粉含量20g、四氧化三鐵含量1g、氧化矽含量0.1g 及矽烷偶聯劑含量1g 可獲得6 小時的懸浮效果；SUS-304 不銹鋼經熱熔膠拋光墊結合磁性流體研磨，其表面粗糙度值可降至0.068 μm。利用兩磁極方式(相吸、相斥)皆較單磁極有較佳的研磨效果。 Polishing pad is an effective tool for polishing workpiece by removing roughness on the surface. Use of polishing pad can be traced back to the ancient mirror polishing of objects of jade, bronze and precious stone. With the development and application of semiconductor production technology and wafer surface polishing the development of polishing pads is also growing in fast pace. While a lot of researches on the polishing conditions and mechanisms have been conducted few studies can be found with the making of new polishing pads. This study focuses at the combined effects on surface profiles of workpieces polished by newly developed polishing pads and polishing conditions. This study employs custom made hot melt adhesive (HMA) pad to polish silicon workpiece surface and SUS-304 stainless surface together with magnetic compound fluid (MCF). The experiments results show that the quality of HMA pad is highly dependent upon the spraying distance when coating pad surface. Surface of HMA pad coated with 5 w.t% grain mixture is of better surface roughness and uniformity (WIWNU) when polishing silicon workpiece. With respect to sub-surface layer of silicon workpiece it is found that the thickness of damage layer is around 100-150 nm and the amorphous silicon layer around 10 nm. When applying MCF polishing to silicon workpiece it is found that better surface quality may be improved as well. For magnetic compound fluid used in stainless workpiece polishing it is found that a mixture of 30 gram silicon oil with 1000 mm2/s viscosity, 10 gram of carbonyl iron powder, 1 gram of ferric ferrous oxide, 0.1 gram silica and 1 gram of Silane coupling agent may give a 6-hour may reach a suspension effect up to 6 hours. Surface roughness of SUS-304 stainless workpiece may be reduced to 0.068 μm after polished by HMA pad together with MCF as dual magnetic poles (either attraction or repulsion) always led to better iii polishing results when compared with single magnetic pole one.
顯示於類別:	[機械工程研究所] 博碩士論文

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