本研究是設計一套即時影像導引連續式微電鍍系統，主要是利用影像處理，辨識出兩極間距後，連續控制微步進馬達移動陰極來保持與微陽極之間的固定距離，來進行微電鍍製程，進而達到連續式微電鍍的目的。系統主要是利用影像辨識回饋來達到保持固定間距的目的，所以良好的影像品質是必要的。因此，針對改善影像品質及精度做深入的探討。 除此之外，並探討連續式微電鍍製程中，銅微柱之沉積速率及沉積尺寸與系統設定參數之關係。並利用系統鑑別推導出系統特性參數，及利用曲線嵌合的技術求出系統的轉移函數，進而模擬出銅微柱長度與直徑沉積的近似曲線。更利用Matlab中的Fuzzy Toolbox來建立分析模型，並利用模糊經驗法則建出模糊規則表，再透過解模糊化後，推論出不同銅微柱沉積之形貌尺寸在連續式微電鍍製程中所需設定參數。並探討所建模型與實際製程中銅微柱沉積之形貌尺寸的誤差。其中微電鍍製程會因為兩極間間距的不同與電壓不同而產生不同的沉積速率，可利用不同可變參數的組合變化去控制，以達到精準沉積所需之銅微柱形貌尺寸及預估銅微柱的沉積速率，並探討不同參數對銅微柱之影響。This research is to design the continuous real-time image guided micro electroplating system with the image processing to distinguish the gap distance between the copper column tip and the anode. With the micro stepper motor, the system keeps the constant distance between the micro-anode and the copper specimen to achieve the continuous electroplating target. Mainly, the system keeps the constant gap distance by image recognition processing. Therefore, capturing clear and good quality images is necessary. Thus, this research will further explore more on how to improve the image qualities. In addition, this research will discuss the relationship between the copper micro-column deposition rate and the setup parameters of the system in the continuous micro electroplating process. To further simulate the approximate curve of the copper micro-column length and the deposition diameter, the system uses the system identification to drive the system parameters and the curve fitting to find out the system transfer function. Furthermore, this research applies the Fuzzy Toolbox of Matlab to setup the model and analyze the fuzzy rule table by using the fuzzy experience rule. Then using the defuzzification infers the required parameters of the different copper micro-column in continuous micro electroplating process and discusses the inaccuracy of different copper micro-column morphologies. Because of the varied gap distance between the two poles and the supplied voltages, the micro electroplating process results the deposition rates differently. Therefore, by examining and analyzing the effects of variable parameters, the system may be able to deposit the required copper micro-column and to estimate the deposition rate.
