研究期間：10106~10205;Thermal dissipation is one of key issues for the application of high-power GaN LEDs. To achieve an excellent thermal system for high-power LED, an effective thermal substrate is required. The advantages of metal LED heat dissipation substrate are (1) high thermal conductivity and less the effect of CTE(Coefficient of thermal expansion) (2) cost is cheaper than ceramic substrate (3) the metal-core substrate is easy to shape and produce. Currently, metal LED heat dissipation substrate is widely used for high-power LED chips. However, there is no systematical study on investigating the effect of the dimensions on the thermal performance of metal-core substrates. In this project, firstly, we developed a reliable junction-temperature and thermal resistance measurement system for high-power LED on metal substrate. Then, the junction temperatures of LED chips on metal substrates with different material and package type were measured. Then, we can study the effect of LED chip power and metal substrate dimensions on the thermal dissipation of metal substrates. At last, the ultimate light output power of high-power LED chips on various metal substrates would be correlated to the thermal dissipation effectiveness of the metal substrates. Also, we develop a high performance metal LED heat dissipation substrate. It can integrate optical, electrical and thermal effect of high LED package characteristic.
