前瞻性銻化物異質材料整合及其高速低功率元件與可調式高頻電路應用之研究-子計畫四：薄膜鐵性材料應用於多晶片模組電源完整性與電磁干擾防治之研究;Ferroelectric and Ferrite Thin-Films and Their Applications in the Power Integrity and Emi Reduction for Multi-Chip-Modules

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题名:	前瞻性銻化物異質材料整合及其高速低功率元件與可調式高頻電路應用之研究-子計畫四：薄膜鐵性材料應用於多晶片模組電源完整性與電磁干擾防治之研究;Ferroelectric and Ferrite Thin-Films and Their Applications in the Power Integrity and Emi Reduction for Multi-Chip-Modules
作者:	林祐生
贡献者:	國立中央大學電機工程學系
关键词:	電子電機工程;電信工程;材料科技
日期:	2012-12-01
上传时间:	2014-03-17 14:18:30 (UTC+8)
出版者:	行政院國家科學委員會
摘要:	研究期間：10108~10207;The purpose of this study is to investigate the application of ferroelectric and ferrite thin-films to the power integrity and electromagnetic interference (EMI) reduction of multi-chip modules. Ferroelectric thin-film exhibits high dielectric constant, and can be used to implement miniature and ultra-thin de-coupling capacitor. Ferrite thin-film possesses high permeability, and can be applied to the design of miniature EMI filters. A proper combination of ferroelectric and ferrite thin-films has the potential to realize highly integrated power integrity and EMI solutions for multi-chip module applications. Compared to the conventional designs of multi-chip modules that focus on the implementation of embedded passives in the module substrate and connect the active circuit chips through wire-bonding or flip-chip, the proposed technology introduce the possibility to also integrate power integrity and EMI solutions in the module substrate throught the use of advanced ferroelectric and ferrite thin-film processes. In this way, a complete “system-on-package” archtecture can be delievered, and it represents a major leap forward in terms of the level of integration for system-in-a-package technologies.
關聯:	財團法人國家實驗研究院科技政策研究與資訊中心
显示于类别:	[電機工程學系] 研究計畫

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