在本論文中，我們探討LED封裝技術平台的建立，研究從固晶、銲線、封膠、玻璃透鏡的黏合到檢測的技術。我們成功封裝出兩款不同晶片結構設計的LED並比較其效率，包括Sapphire-based LED及ThinGaN LED。 此外，我們使用不同的LED封裝，包含裸晶、平面式封裝以及透鏡式封裝，並以蒙地卡羅光線追跡法建立LED光學模型來做驗證。最後，我們針對底部反射率與發光層吸收係數估算LED的光萃取效率，加上實驗量測出的外部量子效率，最後估算LED的內部量子效率。In this thesis, we study the technique for LED package, including die bond, wire bond, encapsulation, glass lens attachment and inspection. We successfully make package of two different chips, sapphire-based LED and ThinGaN LED, and compare the power efficiency.Besides, we change the encapsulation styles, including bare chip, flat top with silicon and with lens, to check the change of the power efficiency under measurement and Monte-Carlo ray tracing. Finally, we estimate the internal quantum efficiency by calculating the light extraction efficiency and measuring the external quantum efficiency.
