LED封裝材料開發與其可靠度追蹤;Development of LED Packaging Materials and Its Reliability Tracking

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/73951

Title:	LED封裝材料開發與其可靠度追蹤;Development of LED Packaging Materials and Its Reliability Tracking
Authors:	劉大銘;Liu, Ta-Ming
Contributors:	化學學系
Keywords:	發光二極體;LED
Date:	2017-07-10
Issue Date:	2017-10-27 12:56:12 (UTC+8)
Publisher:	國立中央大學
Abstract:	本篇論文重點在於合成出一種矽膠改質環氧樹脂的高黏度封裝材，不僅可防止白光LED 的螢光粉沈降，並且藉由相溶性高的Siloxane 混摻，降低封裝材的內應力，同時配合永光化學的安定劑配方，製造出高透明性的LED 封裝材料，而且此複合材料的特性也綜合了Epoxy 與Silicon 的優點-價格便宜、高折射、與支架附著性高、耐熱、耐紫外線與高阻水阻氣性，可應用於所有的照明市場。;Highly transparent encapsulants based on Epoxy and Silicone hybrid for LED were developed. With siloxane contained within, the modified polymers not only mix uniformly with silicone resin to prevent phosphor from settling, but also exhibit lower internal stress; therefore the probability of a LED failure was reduced. Furthermore, with addition of stabilizer, the resin demonstrate good resistance to heat and UV light. With high refractive index, high adhesion, good heat and UV resistance, and low water vapor transmission rate, this low cost new polymers can be practically applied in the lighting market of LED.
Appears in Collections:	[Graduate Institute of Chemistry] Electronic Thesis & Dissertation

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