藉由熱接合、表面改質與溶劑處理方法 封閉於環狀嵌段共聚物與環烯烴共聚物材料上 微流道之研究;Investigation of Cyclic Block/Olefin Copolymer Microchannel Sealing by Thermal Bonding, Surface Modification and Solvent Treatment

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Title:	藉由熱接合、表面改質與溶劑處理方法封閉於環狀嵌段共聚物與環烯烴共聚物材料上微流道之研究;Investigation of Cyclic Block/Olefin Copolymer Microchannel Sealing by Thermal Bonding, Surface Modification and Solvent Treatment
Authors:	顏嘉誼;YEN, Chia-Yi
Contributors:	機械工程學系
Keywords:	微流道;接合;microchannel;bonding
Date:	2017-08-16
Issue Date:	2017-10-27 16:20:02 (UTC+8)
Publisher:	國立中央大學
Abstract:	環狀嵌段共聚物(CBC)是一款新型熱塑性材料，具有優異的光學性質、低吸水率、高耐化性以及低密度等特性，亦可以使用射出成形、射吹成型與壓出成型等加工製程。為了瞭解環狀嵌段共聚物作為微流體晶片材料的適用性，本實驗以環狀嵌段共聚物材料在其上加工微流道後，封閉微流道的品質表現為主要觀察要素。對於可以有效使用的熱塑性微流道晶片製作而言，封閉微流道使其不發生漏液狀況的步驟尤其重要。本實驗使用兩款環狀嵌段共聚物 (CBC010,CBC034) 為主要觀察材料，並與當前已被廣泛使用於微流體晶片材料的環烯烴聚合物(COP)、環烯烴共聚物(COC)做封閉流道之品質表現的對照。目前有各種封閉微流道的方式，本實驗使用三種晶片接合方法: 熱接合、表面經過UV/Ozone曝光改質後再進行熱接合與表面經溶劑處理後施壓接合;。溶劑接合法會使用旋轉塗佈機將三種溶劑(甲苯、正己烷、甲基環己烷)均勻有效率地分布在聚合物試片表面上，使晶片接合面各處受溶劑接觸後的溶解程度均勻並且降低氣泡產生。實驗結果顯示CBC010具有最佳的光學穿透率並具有高熱流動率，導致未經表面處理的最佳化參數晶片熱接合實驗中呈現30%的流道型變量(流道原始高度/寬度:124/200µm)。 CBC034經過表面質改後展現最高的晶片接合強度，並且經過表面改質後在低溫進行晶片熱接合的微流道僅有5.68 µm的縮減量。CBC010經過表面改質後熱接合的流道變型量亦大幅降至5.86 µm，變形量皆小於5%。環烯烴聚合物(COP)與環烯烴共聚物(COC)接觸三種溶劑後，在微流道沒有倒塌和堵塞的情況下成功完成接合。環狀嵌段共聚物(CBC)良好的耐化性使其接觸溶劑後，表面無明顯軟化與流動的現象發生，故無法使用甲苯、正己烷、甲基環己烷進行溶劑處理後的晶片接合。 ;Cyclic block copolymer (CBC) is a new class of thermoplastic with excellent optical property, low water absorption, great chemical resistant and low density. It is also suitable for injection molding, injection blow molding and embossing fabrication process. In order to know the CBC suitability of microfluidic chip, the microchannel sealing quality of microfluidic chip used CBC as substrate material was studied for a functional microchannel chip shows no leakage after microchannel sealing is necessary. This thesis used two grade of cyclic block copolymers (CBC010&CBC034) as main study objects. Cyclic olefin copolymers (COC) and cyclic olefin polymers (COP) were used as microchannel sealing quality comparison group for they have been commonly used in microfluidic chip fabrication. Three bonding methods were used in this study which are: pure thermal bonding, thermal bonding after UV/ozone surface modification and solvent bonding. For solvent bonding, spin coating method was applied for distributing solvents (toluene, n-hexane, methyl cyclohexane) on thermoplastic substrates instead of vaporing and dropping method to efficiently form a uniform and few bubble bonding interface. The experiment results show that CBC010 has extra-high transparency and its high melt flow rate causing 30% channel deformation after pure thermal bonding.(Original channel height/width:124/200µm). After surface treatment, CBC034 showed highest bonding strength and only 5.68µm channel deformation after thermal bonding, the channel deformation of CBC010 also decreased to 5.86µm, both their deformation percentage were lower than 5%. COC and COP microchannel were successfully sealed with three solvents and no clogging and collapse happened. CBC series showed their high solvent resistance that hardly be solvated by solvents that surface didn’t become soft and mobile after solvent treatment.
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