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    題名: 以光學軟性電路板設計適用於4通道 × 25-Gbps 光學連接收發模組之高頻傳輸線;Design of Transmission Lines for 4-Channel × 25-Gbps Optical Interconnect Module Based on Optical Flexible Printed Circuit
    作者: 彭哲瑄;Peng, Che-Hsuan
    貢獻者: 光電科學與工程學系
    關鍵詞: 光學軟性電路板;4通道 × 25-Gbps;光學連接收發模組;Optical Interconnect Module;4-Channel × 25-Gbps;Optical Flexible Printed Circuit
    日期: 2017-08-23
    上傳時間: 2017-10-27 17:20:01 (UTC+8)
    出版者: 國立中央大學
    摘要: 本論文將4通道  25-Gbps高頻傳輸線整合於軟性電路板中,此設計作為連接接收端光偵測器、轉阻放大器(TIA)與發射端垂直共振腔型面射型雷射(VCSEL)、積體驅動晶片(Driver IC)之間的高頻訊號傳輸。而再將上述元件與高分子聚合物波導與45˚反射面共同整合在軟性電路板上。
    此論文評估與分析用於軟性電路板上之高頻傳輸線,包含單端訊號傳輸線(Single-Ended)與差動訊號傳輸線(Differential)的反射損耗(Return loss)與插入損耗(Insertion Loss)。
    傳輸線係以共平面波導(Coplanar Waveguide)形式設計。經由高頻模擬,在操作頻率0~62.5 GHz中,發射端與接收端之單端式高頻傳輸線反射損耗均小於 -4 dB,插入損耗皆大於-2.8 dB。而另一方面在操作頻率0~62.5 GHz,中,差動式高頻傳輸線反射損耗皆小於 -6 dB,插入損耗皆大於 -1.7 dB。
    ;In this paper, the 4-channel  25-Gbps high-frequency transmission line is integrated into the flexible circuit board. This design is used as a high frequency transmission line between a receiver-side photodetector, a transimpedance amplifier (TIA) and a transmitter-side Vertical Cavity Surface Emitting Laser (VCSEL), and an integrated driver chip.And then the above elements and polymer waveguide and 45˚ reflective surface common integration in the flexible circuit board.
    This paper evaluates and analyzes high frequency transmission lines for use on flexible circuit boards, including the single-ended transmission line and differential transmission line of the return loss and insertion loss.
    The transmission lines are designed in the form of a coplanar waveguide. Through the high frequency simulation, the operating frequency of 0 ~ 62.5GHz The single-ended transmission line return loss of the transmitter and the receiver is less than -4 dB, the insertion loss is above -2.8 dB. On the other hand, in the operating frequency of 0 ~ 62.5 GHz, the differential transmission line return loss is less than -6 dB, insertion loss are more than -1.7 dB.
    顯示於類別:[光電科學研究所] 博碩士論文

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