本論文提出以玻璃中介層架構設計適用於高畫質多媒體介面(High Definition Multimedia Interface , HDMI)之光連接收發模組，此模組整合垂直共振腔型面射型雷射、光偵測器、雷射驅動晶片、轉阻放大器晶片、微45°反射面及高分子聚合物波導於玻璃中介層上。其中垂直共振腔型面射型雷射、光偵測器與雷射驅動晶片、轉組放大器晶片之間以高頻傳輸線連接，並以覆晶封裝方式封在玻璃中介層一側，另一側封裝高分子聚合物波導。 經由光學模擬，最佳的光學耦合效率發射端光學系統為57.68%，接收端光學系統為59.62%。在最佳光學耦合效率降至 -1 dB為準為時，雷射與光偵測器位移容忍度均為 9 m以上，在發射端與接收端多模光纖位移容忍度均為 13 m以上。各通道間光學串音干擾在發射端與接收端皆小於 -44 dB以下。 提出的玻璃中介層上之高頻傳輸線設計，發射端與接收端中所設計之單端式高頻傳輸線，在頻率0 ~ 62.5 GHz其反射損耗皆小於 -20 dB、插入損耗皆大於 -0.2 dB。模組內所設計之差動式高頻傳輸線，在頻率0 ~ 50 GHz，四個通道的反射阻抗皆小於 -10 dB、插入損耗皆大於 -1.5 dB。 在印刷電路板上之高頻傳輸線設計，各通道插入損耗在0 ~37.5 GHz皆高於 -2 dB，反射損耗皆低於 -8 dB。最後光連接收發模組覆晶封裝於印刷電路板之差動式高頻傳輸線，各通道插入損耗在0 ~37.5 GHz皆高於 -2 dB，反射損耗在0 ~37.5 GHz皆低於 -7 dB。 ;In this thesis, we proposed the design of optical interconnect transceiver based on glass interposer and applied for High Definition Multimedia Interface (HDMI). The VCSELs, PD, VCSELs Driver IC, TIA, 45° micro-reflector and polymer waveguides will be integrated on glass interposer. The VCSELs, PD and Driver IC, TIA connecting with each other using high-frequency transmission lines and integrated on one side of glass interposer by flip-chip packaging. Polymer waveguides package on another side of glass interposer. The simulation result of maximum optical coupling efficiency is 57.68 % at optical system of transmitting end and 59.62 % at optical system of receiving end. The alignment tolerance at -1 dB level for VCSEL and PD are larger than 9 m, MMF are larger than 13 m at TOSA and ROSA. The optical crosstalk between each channel is smaller than -44 dB at TOSA and ROSA. Design of high-frequency transmission lines on glass interposer is proposed. According to the simulation result, design of single-ended and differential-pair transmission lines for TOSA and ROSA. Single-ended transmission lines at 0~62.5 GHz, return loss is smaller -20 dB and insertion loss larger than -0.2 dB for each channel. Differential-pair transmission lines at 0~50 GHz, return loss is smaller than -10 dB and insertion loss is larger than -1.5dB for each channel. Design of differential–pair transmission lines on printed circuit board (PCB) is proposed. According simulation result, differential-pair transmission lines at 0~7.5 GHz, return loss smaller than -8 dB and insertion loss larger than -2 dB for each channel. Simulation of transmission lines when optical interconnect transceiver flip-chip packaging on PCB, return loss is smaller than -7 dB and insertion loss is larger than -2 dB for each channel.
