ASA-BUS溫度控制介面卡開發及無鉛製程用之小量多樣PCB焊接烤箱改良;ASA-BUS Temperature Control board development and the improvement of small batch multi - pattern PCB welding oven for lead - free process.

NCUIR > Engineering College > Graduate Institute of opto-Mechatronics > Electronic Thesis & Dissertation > Item 987654321/76969

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/76969

Title:	ASA-BUS溫度控制介面卡開發及無鉛製程用之小量多樣PCB焊接烤箱改良;ASA-BUS Temperature Control board development and the improvement of small batch multi - pattern PCB welding oven for lead - free process.
Authors:	莊于霆;Chuang, Yu-Ting
Contributors:	光機電工程研究所
Keywords:	溫度控制;溫度量測;PI控制;焊接烤箱;回焊爐;Temperature control;Temperature measurement;PI control;Welding oven;Reflow oven
Date:	2018-07-23
Issue Date:	2018-08-31 11:54:58 (UTC+8)
Publisher:	國立中央大學
Abstract:	本論文研究目的為開發溫度控制介面卡及改良無鉛製程用之小量多樣PCB焊接烤箱，此溫控介面卡提供2通道RTD回饋溫度控制，經由數位輸出至SSR調整加熱器輸出，再經3線式PT100白金測溫電阻感測回饋來達到控制溫度效果。論文內容中，部分將介紹此回饋溫度控制器，可切換量測通道、設定溫度放大增益、執行精度校正、異常檢測等功能。亦可自行設定目標溫度，放大增益，PI增益等參數。經此溫度介面卡，實現提高測溫精度及達成多樣便利性功能。另一部分將介紹SMD無鉛焊接烤箱改良，經由更改感測器配線形式，減低原烤箱溫度感測誤差大的問題。其次為新增氮氣冷卻氣體銅管設計，改善冷卻系統散熱不佳的問題。 ;The purpose of the paper is to develop an ASA- BUS Temperature Control board and the improvement of small batch multi– pattern PCB welding oven for lead– free process. This ASA- BUS Temperature Control board can provid 2- channe RTD feedback control of temperature, through the digital output to SSR adjust heaters power, then through the feedback of PT100 by 3- wire platinum temperature sensor to achieve control of temperature. In this paper, a part of it will introduce this feedback temperature control board. It can switch measurement channel、set temperature amplification gain、execute accuracy calibration and abnormal detection, and so on. It can also set the objective value of temperature、set amplification gain and PI gain, and so on.Through this temperature control board, accomplish the accuracy of temperature measurement and achieved various convenience features. Another part of this paper will introduce improvement of SMD lead-free reflow oven. First is through change the sensor wiring pattern, reduce the problem of large temperature error in this oven. Second is add a new copper tube of nitrogen cooling to improve the problem of poor cooling system.
Appears in Collections:	[Graduate Institute of opto-Mechatronics] Electronic Thesis & Dissertation

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