摘要 在訊息高速發展的今天，大規模或超大型微電子生產區域因製程技術對無塵室控制環境提出了更高的要求。因而更有效的無塵室氣流組織型式是提高無塵潔淨度的一種有效途徑，本文主要研究與探討了利用數據模擬計算(CFD)技術，在不同的無塵室循環覆蓋率和不同回風型式的無塵室的氣流組成進行模擬，並針對模擬結果運用于實際無塵室所衍生問題進行分析改善說明。 介紹了無塵室技術的運用，本文通過對目前半導體即電子廠行業最常見的無塵室廠房氣流組織類型，層流層流無塵室的空調系統主流設計形式-新風空調箱(MAU：Mack Air Unity)+風機濾網設備(FFU：Fan Filter Unity)+乾冷卻盤管(DCC：Dry Cooling Coil)組合的工作原理，討論對無塵室潔淨度的各方面的影響因素。 選擇CFD技術，採用高雷諾數的Ｋ-ε渦流的數學模型和有限體積的數學離散方法，選用數值模擬軟體Fluent6.0，在不同風機濾網設備(FFU)覆蓋率下，地面華夫孔(Cheese table)回風和側邊下百葉回風兩種送回風方式的無塵室進行氣流組織的模擬評估，得到在不同FFU覆蓋率下的氣流分佈速度，進而運用至實際面板電子廠房于動態條件下所衍生問題進行分析及改善驗證說明。 最後對於全文進行了總結，對垂直層流無塵室氣流組織于未來具體的工程實踐中所碰到的問題需進一步的考量和解決。 ;Abstract Today, with the rapid development of information, large scale or super large scale microelectronics production areas require higher requirements for the control environment of the dust-free room due to process technology. As a result, the more effective air flow pattern in the dust free chamber is an effective way to improve the cleanliness of the dust free. This paper mainly studies and discusses the use of data simulation calculation (CFD) technology to simulate the air flow composition of the dust free chamber with different circulation coverage rate and different return air type. The analysis and improvement of the problems derived from the dust chamber are explained. This paper introduces the application of dust free room technology. In this paper, the main design forms of air conditioning system in the dust-free room of the semiconductor factory are the mainstream design form of the air conditioning system of the vertical laminar dust free room (MAU: Mack Air Unity) + (FFU: Fan Filter Unity) + (DCC: Dry Cooling coil). The working principle of the ng Coil combination is discussed, and the factors affecting cleanliness of the dust-free room are discussed. CFD technology is selected, the mathematical model of K- e eddy with high Reynolds number and the mathematical discrete method of finite volume are used, and the numerical simulation software Fluent6.0 is selected. Under the coverage rate of different fan filter unit (FFU), the airflow organization of two kinds of dust free rooms of the ground Cheese table return air and the side air return air return air mode are carried out. In the simulation evaluation, the velocity of airflow distribution under different FFU coverage is obtained, and then it is applied to the analysis of the problems derived from the actual panel electronic building under the dynamic conditions and the improvement of the verification. Finally, the full text is summarized, and further consideration and solution are needed for the problems encountered in the future concrete engineering practice of the airflow organization in the vertical laminar free chamber.
