| 摘要: | 本研究計畫將開發應用於立方衛星輻射計之先進微波及毫米波前端積體電路和模組，利用國內半導體製程廠所提供的矽基製程和砷化鎵半導體技術完成積體電路設計製作。研製的電路及模組將展現出體積小、重量輕和省電等特點，以滿足二個單位體積的立方衛星設計需求。開發的輻射計需具有高功率偵測靈敏度、低的等效雜訊功率及低直流功率消耗，其三個接收頻率窗口分別為22、29-32和89 GHz，主要應用於大氣中水蒸氣量測。計畫執行期間將建立毫米波輻射計系統分析平台，毫米波積體電路設計和模組構裝技術開發。開發的積體電路包含有切換器、低雜訊放大器、混波器、功率偵測器及本地振盪訊號源等關鍵元件。進一步將開發完成的前端積體電路應用於輻射計模組上，進行溫度變異測試評估，以滿足立方衛星任務需求。在接收機研究上，著重於雜訊指數降低及轉換增益提升。在本地振盪訊號源研究上，著重於相位雜訊和抖動降低。預期可得到成果為毫米波輻射計及立方衛星相關技術建立、參與研究計畫之人員培育、創新積體電路開發研究、相關量測技術發展及高整合前端模組和電路之相關技術研究。在此三年研究計畫，工作項目將包含系統規劃、電路設計及佈局、晶片製作與評估。將研製低雜訊前端模組和積體電路，設計及佈局將完成並送至代工廠製作。最後，完成量測分析。 ;Advanced microwave and millimeter-wave (MMW) integrated circuits (ICs) and module will be developed for the applications of the radiometer in Cubesats. The ICs will be designed using several silicon-based and GaAs processes provided by the domestic semiconductor foundries. The developed ICs and module will feature compact size, low weight, and low dc power consumption to satisfy the specification of the 2-Unit Cubesat. The developed radiometer should have high sensitivity of power detection, low equivalent noise, and low dc power consumption, the three spectral windows are 22, 29-32, and 89 GHz, respectively, for the atmospheric water vapor measurement. During the project progress, the research works contain the development of the system analysis, MMW ICs, and the package technology for the radiometer. The developed ICs include switch, low noise amplifier, mixer, power detector, and local oscillation source, and they will be further employed in the radiometer module. The developed circuits and module will be evaluated with temperature variation to achieve the design goals of the Cubesats. In the receiver, we will focus on the research of low noise figure and high conversion gain. In the local oscillation source, we will focus on the research of low phase noise and low jitter. The establishment of the MMW radiometer technology, the innovative ICs, the related measurement technology, and the innovative frontend ICs and modules will be achieved. The system planning, IC design, chip layout, fabrication and chip evaluation will be exercised during the three years. The design will also be completed and sent to the foundry for fabrication. In last, the measurement and analysis of the developed MMW frontend ICs and module will be carried out. |
