結合物聯網與現場驗證之晶片退貨效能增進研究;Efficiency Improvement of Chip Return Process Based on On-Site Verification and IoT

NCU Institutional Repository > 資訊電機學院 > 通訊工程學系碩士在職專班 > 博碩士論文 > Item 987654321/85033

請使用永久網址來引用或連結此文件: http://ir.lib.ncu.edu.tw/handle/987654321/85033

題名:	結合物聯網與現場驗證之晶片退貨效能增進研究;Efficiency Improvement of Chip Return Process Based on On-Site Verification and IoT
作者:	王健宇;Wang, Chien-Yu
貢獻者:	通訊工程學系在職專班
關鍵詞:	晶片;物聯網;驗證;GPU;RMA;LoRa
日期:	2021-01-20
上傳時間:	2021-03-18 17:25:11 (UTC+8)
出版者:	國立中央大學
摘要:	近年來，晶片產業越來越重要，運用範圍也越來越廣。除了是各種智慧型產品、遊戲顯示卡、數據中心…等的重要核心外，更是未來AI、雲端物聯網、自駕車等不可或缺的一部分，就連中國也正舉全國之力要來發展半導體晶片產業。對於一個IC設計公司來說，業務銷售推廣及IC設計部門固然重要，但是產品品質控管及售後服務也不能忽視，而提升產品及服務品質往往是公司能更上一層走向永續經營的關鍵之一。本文除了介紹何謂退貨授權(Return Merchandise Authorization, RMA)及GPU晶片外，主要專注討論於我們如何在一般退貨授權的流程中能夠更有效率地找出晶片不良原因並將結果快速回報給客戶和公司，以增加客戶退貨的效益及減少不必要的資源浪費。本文提出在基於退貨授權的流程中執行現場驗證(On Site Verification, OSV)來驗證不良的晶片，並透過物聯網無線通訊技術，即時地將OSV數據呈現在客戶及公司端上。有別於以往RMA，晶片不需要先寄送到國外相關部門而是直接在客戶端先行驗證，能達到在最短的時間初步判斷產品狀況，除此之外也比較不會讓客戶有沒材料更換的情況發生。 ;In recent years, the chip industry has become more and more important and its application scope has become wider and wider. In addition to being an important core of various smart products, graphics cards, data centers, etc., it is also an indispensable part of the future AI industry, cloud Internet of things, and self-driving cars. Even China is doing its best to develop the semiconductor chip industry. For an IC design company, the business sales promotion and IC design department are important, but product quality control and after-sales service also cannot be ignored. Improving the quality of products and services has always been one of the keys for the company to move to a higher level and move towards sustainable operation. In addition to introducing what is meant by Return Merchandise Authorization (RMA) and GPU chips, this article focuses on how we can more efficiently find out the causes of chip defects in the general return authorization process and quickly return the results from customers and companies. Increase the efficiency of customer returns and reduce unnecessary waste of resources. This article proposes to perform On Site Verification to verify defective chips in a return material authorization-based process. Unlike previous RMA, the chips do not need to be sent to relevant foreign departments first, but directly on the client side doing verification. Achieve a preliminary judgment on the product condition in the shortest time. In addition, it is less likely to let customers have no material replacement.
顯示於類別:	[通訊工程學系碩士在職專班 ] 博碩士論文

文件中的檔案:

檔案	描述	大小	格式	瀏覽次數
index.html		0Kb	HTML	249	檢視/開啟

在NCUIR中所有的資料項目都受到原著作權保護.

社群 sharing

資料載入中.....