具多維奈米結構熱介面材料開發與熱管理應用;Development of thermal interface materials with multi-dimensional nanostructures and thermal management applications

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题名:	具多維奈米結構熱介面材料開發與熱管理應用;Development of thermal interface materials with multi-dimensional nanostructures and thermal management applications
作者:	吳紹偉;Wu, Shao-Wei
贡献者:	機械工程學系
关键词:	多維度(3D/2D/1D);熱介面材料;聚二甲基矽氧烷(PDMS);熱管理應用;奈米銀線(AgNWs);multi-dimensional(3D/2D/1D);Thermal interface materials (TIMs);Polydimethylsiloxane(PDMS);thermal management applications;Silver nanowires (AgNWs)
日期:	2021-07-15
上传时间:	2021-12-07 13:19:29 (UTC+8)
出版者:	國立中央大學
摘要:	本研究主要在探討開發新型異質接面奈米結構之熱介面材料(TIMs) ，因高功率電子元件運作時必須轉移到一個散熱器，並最終消散到周圍環境，會產生大量熱能，若電子元件與散熱話接觸面會產生間隙，進而形成一層熱阻抗(Thermal resistance)，因此透過開發高熱導率TIMs可將電子元件與散熱器之間間隙填補進而提升熱傳導性能，對於高功率電子元件的散熱能大幅改善並提高電子元件壽命。本研究係藉由多維奈米結構方式，在AFLG中加入奈米銀線(Sliver nanowires，AgNWs) 再利用網印技術印刷至3D結構(纖維)上，混入自備之銅粉。使用將材料嵌入聚二甲基矽氧烷(PDMS)，及利用網印技術製造具奈米複合結構作為可具拉伸能力和低成本的熱界面材料，探討其熱界面材料之水平與垂直方向之熱傳導系數，利用熱顯像儀進行溫度量測及觀察其散熱效果，並且實際應用於CPU、LED等發熱元件上進行散熱能力測試。;Due to the increasing demand for high-power density of electronic devices, the technological enhancement of Thermal Interface Materials (TIMs) is crucial for further advancement of thermal management. Graphene displayed a considerable possibility for advancing thermal interface materials because of its extreme-high thermal conductivity. Modest quantities of 2D (two-dimensional) graphene sheets are typically mixed into a polymer matrix to manufacture the nano-composites with enhanced functional or mechanical properties. A simplistic and useful method to bond a few-layer graphite (AFLG) and AgNWs with polydimethylsiloxane (PDMS), print on the high thermal conductivity three-dimensional (3D) structure fiber with different ratios of Cu powder, the corresponding composite with the improvement of thermal conductivity is made. The thermal conductivity of composites with 20 wt% AFLG, AgNWs at 2.0mg/mL displays an increase when the Cu particles loading of 2.5 wt% to 7.5 wt% adding. The effect is attributed to the intercalation of spherical copper particles between other fillers, which comes out the percolation network formation with highly thermal conductivity. Thermal conductivity of through-plane (KX) 5.96 W/mK and in-plane (KZ) 41.7W/mK are achieved in composites with 7.5 wt% copper particle loading. Consequently, the process in this study endows these nano-composites with high thermal conductivity. Besides, the proposed nanostructure-tailored nano-composites are promising for surface variations with time during heating and cooling. The results have brightly shown the interaction between the Cu particles and above fillers in the nano-composites and demonstrate the potential of the hybrid nano-composites in the field of TIMs for practical applications.
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