自動化光學檢測之印刷電路板除膠雛型機之開發;Development of a Prototype Machine for Removing Glue on Printed Circuit Boards by Automated Optical Inspection

NCUIR > Engineering College > Graduate Institute of Mechanical Engineering > Electronic Thesis & Dissertation > Item 987654321/87021

Please use this identifier to cite or link to this item: http://ir.lib.ncu.edu.tw/handle/987654321/87021

Title:	自動化光學檢測之印刷電路板除膠雛型機之開發;Development of a Prototype Machine for Removing Glue on Printed Circuit Boards by Automated Optical Inspection
Authors:	施庭宇;Shih, Ting-Yu
Contributors:	機械工程學系
Keywords:	自動化光學檢測;除膠;印刷電路板;雷射;AOI;PCB;Laser
Date:	2021-10-12
Issue Date:	2021-12-07 13:45:04 (UTC+8)
Publisher:	國立中央大學
Abstract:	在工業 4.0 的潮流下，工業自動化勢不可擋。自動化光學檢測(AOI)是現代工業品管自動化的重點技術，本研究將以印刷電路板(PCB)除膠機為題，整合一套具自主整合技術的 AOI 自動化 PCB 除膠機，協助國產自動化產業的自主技術的發展。本研究整合三軸精密平台、線性掃描相機、同軸視覺系統等三大設備，以 OpenCV 函式庫做為影像處理的核心。運用線性掃描相機完成 PCB 表面殘膠的粗定位，確定所有殘膠座標後，依序將待消除的殘膠移至同軸視覺系統的振鏡下方執行精定位除膠。精定位流程將辨識殘膠的輪廓並規劃雷射除膠路徑，由振鏡快速移動雷射光束去除殘膠。實驗結果表明該套雛型機已能完成 PCB 表面殘膠的除膠任務，但處理速度仍有待加強。未來持續優化程式表現後，即可上線運作，提升生產效率。;Under the Industry 4.0, automated optical inspection (AOI) is the key technology of modern industrial quality on control automation. This research will focus on the system integration technology of printed circuit board (PCB) residual glue removing by AOI system. This technology is autonomous, so it can promote the development of this country’s autonomous technology. This research can be divided three major equipments : precision three-axis granite gantry platform, linear scan camera and coaxial laser vision system. The program of this research uses OpenCV library as the core of image processing. The linear scanning camera is used to detect the rough position of the residual glues on the PCB surface. After all the residual glues coordinates are determined by linear scan camera, the residual glues will be moved to the central of the coaxial laser vision system sequentially. Then the residual glues will be fine positioning and removed by laser. The precise positioning process will identify the contour of the residual glue firstly. Then it will plan the laser glue removal path, and control the galvanometer quickly move the laser beam to remove the residual glue. The experimental results show that the prototype machine can complete the goal of removing the glue on the PCB surface, but the processing speed still needs to be strengthened. After the program performance is continuously optimized in the future, it can be put into operation to improve production efficiency.
Appears in Collections:	[Graduate Institute of Mechanical Engineering] Electronic Thesis & Dissertation

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