低溫錫鉍合金與銅基材之濕潤性質探討

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Title:	低溫錫鉍合金與銅基材之濕潤性質探討
Authors:	莊博勛;Zhuang, Bo-Xun
Contributors:	化學工程與材料工程學系
Keywords:	濕潤性;接觸角;錫鉍;銲料
Date:	2023-08-14
Issue Date:	2024-09-19 14:48:52 (UTC+8)
Publisher:	國立中央大學
Abstract:	隨著先進電子構裝的技術提升，由於多層堆疊的結構中內含有各種不同性質的材料，高溫製程容易造成晶片翹曲及長期可靠度的問題，Sn-58Bi銲料之熔點為138度、具有好的抗潛變能力。濕潤性質對於迴焊是非常重要的，所以本實驗選用助焊劑含鹵素及不含鹵素之Sn-58Bi銲料及不含鹵素之Sn-56Bi1Ag0.2C銲料探討其在銅基板上於不同迴焊溫度及時間的濕潤性質。從TG-DTA結果發現，有無鹵素對銲料熔點並無影響，然而添加銅銀之後銲料熔點下降了一度，含鹵素之SnBi銲料之接觸角不論時間長短或迴焊時間長短都大於18度，說明溫度對於該銲料濕潤性質影響不大，然而不含鹵素的SnBi銲料接觸角都比含鹵素銲料低，說明其濕潤性質較好。從前面的熱分析結果發現，在到達熔點後其熱重損失率有鹵素銲料為無鹵素銲料的兩倍多，代表助焊劑在迴焊過程中快速的揮發，來不及保護銲料及基板被氧化，造成濕潤性質下降，另外再添加了銀銅的SnBi銲料因為銀具有良好的抗氧化性，使銲料之接觸角降低，同時使濕潤性質變好。 ;With advancements in advanced electronic packaging technologies, the inclusion of various materials with different properties in multilayer stack structures poses challenges such as chip warpage and long-term reliability issues when subjected to high-temperature processes. Sn-58Bi solder, with a melting point of 138°C, exhibits excellent resistance to creep deformation. Wetting property is crucial during reflow, thus in this experiment, both halogen-containing and halogen-free Sn-Bi solder, as well as halogen-free Sn-56Bi1Ag0.2C solder, were selected to investigate their wetting characteristics on copper substrates at different reflow temperatures and times. From the TG-DTA results, it was observed that the addition of halogens had no impact on the solder′s melting point. The addition of copper-silver to the solder resulted in a one-degree decrease in the melting point. For the halogen-containing SnBi solder, the contact angle was consistently above 18 degrees. This indicates that temperature had minimal effect on the wetting property . On the other hand, the halogen-free solder exhibited lower contact angles compared to the halogen-containing solder, indicating better wetting characteristics. The thermal analysis results showed that the halogen-containing solder had a rapidly weight loss rate after reaching the melting point. This suggests that the flux in the halogen-containing solder evaporated rapidly during the reflow process, possibly leading to insufficient protection of the solder and substrate from oxidation, resulting in a decrease in wetting property. The addition of silver and copper to the SnBi solder improved wetting characteristics, as silver possesses excellent antioxidation properties, leading to better wetting properties.
Appears in Collections:	[National Central University Department of Chemical & Materials Engineering] Electronic Thesis & Dissertation

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